Full-Wafer Laser Heating in EPI Chambers With Lower Complexity
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Solution Overview
Problem
Conventional semiconductor processing chambers are large, complex, and lack process variability due to the use of lamps as primary heating sources, leading to high costs and significant workspace occupation.
Innovation Solution
A thermal processing chamber utilizing a laser heating system with an upper and lower heating device, each comprising a cooling plate, base members, optical fibers, and light sources to provide controlled heating to substrates, allowing for more direct and flexible heating control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If lamps are used as the primary heating source, then the chamber can provide heating function, but the chamber complexity increases and process flexibility decreases
Solution Approach 1:
The patent replaces the conventional lamp-based heating system with a laser-based heating system. The laser light source delivers energy directly to the substrate through optical fibers, eliminating the need for complex lamp assemblies, reflectors, and thermal management components. This substitution of mechanical/optical systems enables precise spatial and temporal control of heating, significantly improving process flexibility while reducing chamber complexity
Solution Approach 2:
The patent changes the fundamental heating parameter from broad-spectrum thermal radiation (lamps) to monochromatic coherent light (lasers). This parameter change allows for selective heating of specific substrate regions through wavelength control and enables dynamic adjustment of heating profiles through pulse duration and intensity modulation, thereby enhancing process versatility without requiring complex chamber hardware
2Area of stationary object
If conventional lamp heating systems are used, then heating can be provided, but the footprint and workspace occupation increase
Solution Approach 1:
The patent segments the heating function into multiple independent laser sources that can be positioned compactly around the chamber. Each laser module with its optical fiber can be independently controlled and positioned, allowing the heating capability to be distributed in a compact configuration rather than requiring a single large lamp assembly, thus reducing the overall footprint while maintaining heating power
Solution Approach 2:
The patent transitions from planar lamp arrangements to three-dimensional laser positioning using optical fibers that can be routed through and around the chamber in multiple dimensions. This allows the light sources to be delivered from various spatial locations (including through the chamber walls) without increasing the chamber's external footprint, enabling powerful heating capability in a compact workspace
3Manufacturing precision
If lamps are used for chamber heating, then heating coverage is provided, but process variability control is reduced
Solution Approach 1:
The patent applies local quality by enabling different regions of the substrate to receive different laser intensities, wavelengths, or pulse patterns through independent optical fiber control. This allows precise spatial control of temperature profiles across the substrate surface, enabling different process conditions in different zones simultaneously, thereby improving manufacturing precision while increasing process variability control
Solution Approach 2:
The patent employs periodic action through pulsed laser heating, where laser energy is delivered in controlled pulses rather than continuous illumination. This enables precise temporal control of heating cycles, allowing for rapid heating and cooling phases that improve temperature control precision and enable a wider range of thermal processing profiles, thereby enhancing both manufacturing precision and process variability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laser heating system reduces chamber complexity, increases process flexibility, and provides precise temperature control, thereby improving the efficiency and variability of semiconductor processing while minimizing the overall footprint.
Implementation Method 1
one or more optical fibers connected to the one or more upper light sources and the upper base member
Implementation Method 2
one or more upper light sources, one or more optical fibers connected to the one or more upper light sources
Implementation Method 3
an upper cooling plate, one or more upper base members disposed on the upper cooling plate
Data Source
AI summary
An apparatus for heating a substrate within a thermal processing chamber is disclosed. The apparatus includes a chamber body, a gas inlet, a gas outlet, an upper window, a lower window, a substrate support, and an upper heating device. The upper heating device is a laser heating device and includes one or more laser assemblies. The laser assemblies include light sources, a cooling plate, optical fibers, and irradiation windows.