Functional Element Bonding for Fiber-Plastic Adhesive Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for attaching functional elements to fiber-reinforced plastic components using adhesives face challenges such as adhesive damage or loss during handling and transport, particularly when using adhesive rings or double-sided tape.
Innovation Solution
An apparatus and method where functional elements are guided by a device to an adhesive depot within a setting head, ensuring the adhesive is applied just before use, reducing the transport distance and risk of damage, and using a rotatable wheel or revolving conveyor to transfer elements directly to the setting position with a compact and protected adhesive supply system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive rings or double-sided tape are used for attaching functional elements, then the attachment process can be simplified, but the adhesive is vulnerable to damage or loss during handling and transport
Solution Approach 1:
The adhesive is applied to the functional element during the attachment process itself, rather than being pre-applied and transported. The adhesive application device applies adhesive to the functional element as it passes through the attachment device, ensuring the adhesive is fresh and undamaged when needed.
Solution Approach 2:
The adhesive is extracted from the adhesive application device and applied directly to the functional element at the moment of attachment, rather than being transported as pre-formed adhesive rings or tape. This eliminates the vulnerability of pre-formed adhesive carriers during handling and transport.
2Extent of automation
If adhesive rings are transported on a carrier band to the setting device, then the adhesive supply can be automated, but the transport distance increases the risk of adhesive damage
Solution Approach 1:
The adhesive is prepared and held in the adhesive application device just before application, rather than being transported over long distances on a carrier band. The functional element passes through the adhesive application device where adhesive is applied at the moment of need, minimizing exposure time and damage risk.
Solution Approach 2:
The adhesive application device serves as an intermediary between the adhesive supply and the functional element, applying adhesive directly to the functional element as it passes through, rather than transporting pre-formed adhesive carriers on a separate carrier band.
3Ease of manufacture
If functional elements are transported with pre-applied adhesive over long distances, then the attachment process can be separated from adhesive application, but the adhesive is exposed to damage and loss
Solution Approach 1:
The adhesive is applied to the functional element at the moment of attachment in the adhesive application device, rather than being pre-applied and transported. This ensures the adhesive is applied only when needed and minimizes the distance the adhesive must be transported, reducing loss and damage.
Solution Approach 2:
The adhesive application and functional element attachment occur in continuous sequence as the functional element passes through the attachment device, eliminating the need to transport pre-applied adhesive carriers separately. The adhesive is applied continuously at the point of use.
Data Source
AI summary
An apparatus and a method for attaching functional elements, e.g. composed of metal, to a component, in particular to a component comprising fiber-reinforced plastic, while using a setting head, wherein the functional element has a contact surface provided with adhesive and wherein the adhesive can be supplied to the setting head in individual depots adapted to the functional elements on a carrier band is characterized in that the functional elements are taken over by a guide device and are each pressable to an adhesive depot and are subsequently guidable with the adhering adhesive depots and separately from the carrier band in the setting head to the setting position in front of a setting die.