Electrically Functional Heat Transfer Structures for Stacked Dies
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Solution Overview
Problem
The challenge of efficiently dissipating heat in vertically stacked semiconductor packages is significant, leading to elevated operating temperatures that exceed maximum limits, particularly in devices with increased processing power and reduced footprint.
Innovation Solution
Incorporating electrically functional heat transfer structures (HTS) that are positioned adjacent to the die stack, utilizing materials like silicon volumes to form capacitors, which provide both electrical functionality and efficient heat transfer, thereby reducing operating temperatures and enabling smaller package sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vertically stacked semiconductor dies are used to increase processing power without increasing package footprint, then functional capacity and processing power are improved, but heat dissipation becomes difficult and operating temperatures exceed maximum limits
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat transfer by positioning heat transfer structures in the vertical dimension adjacent to the die stack. The HTS extends vertically to contact multiple dies at different heights, enabling heat removal in the z-direction rather than only laterally, thus resolving the thermal management challenge of vertically-stacked high-density packages
Solution Approach 2:
The patent introduces an intermediary heat transfer structure that mediates between the heat-generating die stack and the heat sink. The HTS acts as a thermal conduit with high thermal conductivity, transferring heat from the dies to external cooling structures, thereby preventing direct thermal coupling that would lead to excessive temperature rise
2Adaptability or versatility
If vertically stacked semiconductor dies are used to increase functional capacity, then device functionality is improved, but heat generated is difficult to dissipate
Solution Approach 1:
The patent implements multi-functionality by designing the heat transfer structure to serve dual purposes: providing efficient thermal management while simultaneously offering electrical functionality. The HTS can be electrically coupled to the die stack to provide additional electrical connections, thereby reducing the need for separate dedicated heat sink structures and improving overall space utilization
Solution Approach 2:
The patent employs composite material structures for the heat transfer structure, combining materials with high thermal conductivity for efficient heat transfer while incorporating electrically conductive elements to provide electrical functionality. This composite approach enables simultaneous optimization of thermal and electrical performance in a single integrated structure
3Temperature
If electrically functional heat transfer structures are used, then heat transfer efficiency is improved and electrical functionality is provided, but device complexity increases
Solution Approach 1:
The patent merges previously separate functions into a single integrated heat transfer structure. The HTS combines heat dissipation functionality with electrical connection capabilities, eliminating the need for separate dedicated heat sink structures and reducing overall device complexity despite the advanced functionality provided
Solution Approach 2:
The patent applies partial action by implementing electrical functionality only in the portions of the heat transfer structure where it is most beneficial, rather than making the entire structure electrically active. This selective approach provides necessary electrical connections while minimizing the added complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The HTS structures effectively transfer heat away from the die stack, maintaining optimal operating temperatures while allowing for compact designs with additional space for functional components, enhancing performance and functionality.
Implementation Method 1
The HTS structures effectively transfer heat away from the die stack
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
Semiconductor device assemblies having stacked semiconductor dies and electrically functional heat transfer structures (HTSs) are disclosed herein. In one embodiment, a semiconductor device assembly includes a first semiconductor die having a mounting surface with a base region and a peripheral region adjacent the base region. At least one second semiconductor die can be electrically coupled to the first semiconductor die at the base region. The device assembly can also include an HTS electrically coupled to the first semiconductor die at the peripheral region.