Functional Inlay Antenna Alignment for Thin RFID Manufacturing
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Solution Overview
Problem
Existing methods for manufacturing high-frequency RFID inlays with smaller chips are limited by the need for larger chip modules, which restrict the thickness of the inlays and introduce positioning challenges when embedding wire antennas in substrates.
Innovation Solution
A method that precisely determines and adjusts the relative positions of wire antenna portions and chip connection pads within predetermined tolerances, allowing for accurate bonding and minimizing manufacturing errors by using optical means and iterative repositioning of wire antenna portions until tolerances are met.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If smaller chips are used instead of larger chip modules, then the inlay thickness is reduced, but positioning precision deteriorates
Solution Approach 1:
The patent applies preliminary action by measuring and determining the positions and dimensions of wire antenna portions and aperture before the bonding process. Optical means are used to acquire position data, and predetermined tolerances are established in advance to guide the placement of smaller chips, ensuring positioning precision is maintained despite the reduced inlay thickness.
2Manufacturing precision
If iterative repositioning of wire antenna portions is performed, then bonding precision is improved, but manufacturing time increases
Solution Approach 1:
The patent implements feedback by measuring the positions and dimensions of wire antenna portions and aperture, comparing them against predetermined tolerances, and using this information to guide iterative repositioning of wire antenna portions. Optical means provide continuous feedback on positioning accuracy, allowing the process to self-correct and achieve bonding precision while managing manufacturing time through automated measurement and comparison.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of thinner high-frequency RFID inlays by ensuring precise alignment and bonding, reducing manufacturing errors and improving yield in industrial processes.
Implementation Method 1
acquiring the positions and the dimensions of said wire antenna portions and/or said aperture
Implementation Method 2
an electrical connection is realized between the terminal contact areas and the initial and final antenna regions of the antenna by means of a thermode which, under the influence of pressure and temperature, creates a connection by material closure
Data Source
AI summary
The method of manufacturing a functional inlay, comprises at least the steps of: (1) providing a substrate with a wire antenna embedded therein and with an aperture wherein two wire antenna portions are positioned over said aperture; (2) acquiring the positions and the dimensions of said wire antenna portions and of said aperture; (3) determining if the acquired positions and dimensions meet predetermined tolerances; (4) if the acquired dimensions and positions meet said tolerances, then placing a chip in fie aperture so that said wire portions are positioned over connections pads of said chip and then bonding said wire portions to said connection pads.