Functional Label Bonding on Complex Carriers Without Bubbles
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Solution Overview
Problem
Existing methods for integrating functional labels, such as touch sensors, into components are limited by design constraints, mechanical weaknesses, and difficulties in automation, particularly for complex geometries, leading to issues like mechanical bending, thermal distortion, and defects like wrinkles and bubbles.
Innovation Solution
A method using a device with a label pickup, carrier pickup, and adhesive dispensing unit to apply a flexible label with electrical or optoelectronic components onto a carrier, employing a flowable adhesive that is cured and crosslinked, allowing for precise placement and distribution to fill surface unevenness and enclose particles, enabling automated production of complex components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high pressure and high temperature are used in manufacturing processes, then the label is bonded to the component carrier, but mechanical bending and thermal distortion occur
Solution Approach 1:
The patent changes the parameters of the adhesive from high-temperature thermoplastic adhesive to low-temperature curing adhesive (such as UV-curing adhesive). This allows bonding to occur at room temperature or low temperature, eliminating thermal distortion and mechanical bending while maintaining bond strength.
Solution Approach 2:
The patent replaces mechanical bonding methods (heated stamping, high-pressure bonding) with chemical bonding methods (UV-curing adhesive, low-temperature curing adhesive). The adhesive cures through chemical reaction rather than thermal-mechanical processes, avoiding the harmful effects of high temperature and pressure on component geometry.
2Strength
If high pressure and high temperature are used in manufacturing processes, then the label is bonded to the component carrier, but functions in the label are damaged
Solution Approach 1:
The patent changes the curing parameters from high temperature to low temperature or UV light activation. This preserves the functionality of integrated sensors and electronic components that would be damaged by high temperature and pressure, while still achieving strong bonding through adhesive curing.
3Strength
If high pressure and high temperature are used in manufacturing processes, then the label is bonded to the component carrier, but outgassing occurs and bubbles form
Solution Approach 1:
The patent changes from thermal curing at high temperature to UV-curing or low-temperature curing. This prevents outgassing of plastic materials that occurs at elevated temperatures, eliminating bubble formation while maintaining bond strength through alternative curing mechanisms.
4Ease of manufacture
If manual or semi-automated lamination is used, then the label is applied to the component carrier, but high positional tolerances occur and automation is difficult
Solution Approach 1:
The patent employs adhesive dispensing systems that automatically apply adhesive in precise patterns, and UV-curing systems that automatically cure the adhesive in the correct positions. The process self-regulates through automated positioning and curing, achieving high precision without manual intervention.
Solution Approach 2:
The patent replaces manual positioning and alignment with automated dispensing and UV-curing systems. The adhesive is applied automatically in precise patterns, and UV light cures the adhesive in exact positions, eliminating the positional tolerances associated with manual lamination.
5Ease of manufacture
If mechanical integration by clamping is used, then the label is attached to the component carrier, but weak points occur due to gaps and relative movements
Solution Approach 1:
The patent replaces mechanical clamping connections with chemical adhesive bonding. The adhesive creates a continuous bond between the label and component carrier, eliminating gaps and preventing relative movements that cause weak points in mechanical connections.
6Reliability
If optical bonding with OCR is used, then flat glass panes are bonded together, but design freedom is restricted
Solution Approach 1:
The patent changes from optical bonding requiring flat surfaces to adhesive bonding that can accommodate complex geometries. The UV-curing adhesive can be applied to and cured on curved, irregular, and three-dimensional surfaces, enabling design freedom while maintaining bond stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the reliable, automated application of flexible labels onto complex carriers with minimal mechanical and thermal stress, reducing defects and improving the stability and visual appearance of components by ensuring uniform adhesive distribution and preventing bubbles.
Implementation Method 1
at least partially curing and/or at least partially crosslinking the one or more adhesive layers
Data Source
Figure 1a~2a
Figure 2b~2c
Figure 3a~3b
AI summary
A method and a device for manufacturing a component (1), wherein a label (2) with a flexible layer structure comprising a carrier layer (23) and a further layer (22) and/or an electrical/electronic/optical component (261) is received by a label receiver (20), wherein a carrier (3) is received by a carrier receiver (30), wherein a flowable adhesive (4) is applied to the label (2) and/or the carrier (3), and a relative movement (45) of the label receiver (20) and carrier receiver (30) is carried out, wherein the adhesive (4) is arranged between the label (2) and the carrier (3) so that an adhesive layer (41) is obtained, and wherein at least partial curing and/or crosslinking of the adhesive layer is subsequently carried out. The invention further relates to a component (1) thus obtainable.