Functional Layer Composition for Adhesion and Blocking Resistance

Solution Overview

Problem

Existing electrochemical devices face issues with misalignment and blocking during production and storage due to inadequate process adhesiveness and blocking resistance in functional layers, leading to reduced productivity and electrochemical characteristics.

Innovation Solution

A composition for an electrochemical device functional layer using a binder and a particulate polymer with a specific molecular weight distribution (Mw/Mn of 1.0 to 3.0) and a glass-transition temperature of 25°C to 90°C, optionally including non-conductive heat-resistant particles, to enhance process adhesiveness and blocking resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a functional layer is formed to improve heat resistance and strength, then the structural performance is improved, but the process adhesiveness between electrochemical device members deteriorates

Engineering Contradiction:

Improveheat resistance and strengthVSAvoidprocess adhesiveness

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The functional layer uses a composite composition containing both a polymer component (for heat resistance and strength) and a particulate polymer component (for adhesiveness). This composite structure allows simultaneous achievement of structural performance and process adhesiveness by combining materials with complementary properties.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent specifies controlling the molecular weight average ratio (Mw/Mn) of the particulate polymer within 1.05 to 3.00 to optimize the balance between heat resistance and adhesiveness. By adjusting this parameter, the functional layer achieves both improved structural performance and adequate process adhesiveness.

Inventive Principle:

Principle #35Parameter changes

2Strength

If a functional layer is formed to improve heat resistance and strength, then the structural performance is improved, but the blocking resistance during storage and transportation deteriorates

Engineering Contradiction:

Improveheat resistance and strengthVSAvoidblocking

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The functional layer uses a composite composition containing both a polymer component (for heat resistance and strength) and a particulate polymer component (for adhesiveness). This composite structure allows simultaneous achievement of structural performance and process adhesiveness by combining materials with complementary properties.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent specifies controlling the molecular weight average ratio (Mw/Mn) of the particulate polymer within 1.05 to 3.00 to optimize the balance between heat resistance and adhesiveness. By adjusting this parameter, the functional layer achieves both improved structural performance and adequate process adhesiveness.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If existing particulate polymers are used in functional layer composition, then adhesiveness is improved, but the molecular weight distribution is not optimized for simultaneous improvement of process adhesiveness and blocking resistance

Engineering Contradiction:

ImproveadhesivenessVSAvoidblocking

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent specifies controlling the molecular weight average ratio (Mw/Mn) of the particulate polymer within 1.05 to 3.00, which optimizes the molecular weight distribution to simultaneously achieve high process adhesiveness and blocking resistance. This parameter control ensures the particulate polymer provides adequate adhesiveness while maintaining blocking resistance during storage and transportation.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS12573716B2Composition for electrochemical device functional layer, laminate for electrochemical device, and electrochemical device

Publication Date: 2026.03.10 ZEON CORP

AI summary

Provided is a composition for an electrochemical device functional layer with which it is possible to form a functional layer for an electrochemical device that can impart excellent process adhesiveness and blocking resistance to an electrochemical device member such as an electrode or a separator and that can cause an electrochemical device to display excellent electrochemical characteristics. The composition for an electrochemical device functional layer contains a particulate polymer and a binder. The particulate polymer has a molecular weight distribution (weight-average molecular weight (Mw)/number-average molecular weight (Mn)) of not less than 1.0 and not more than 3.0.