Functional Layer Marking for Thin Electronic Components

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for forming functional layers on electronic components require additional processing steps to add information, which increases manufacturing time and cost, and can result in thicker components due to separate information marking layers, affecting miniaturization and efficiency.

Innovation Solution

A method where information is integrated into the functional layer by forming an information area with a distinct shape or pattern within the same layer as the non-information area during the layer's formation, using materials that create a recognizable color difference, allowing for simultaneous formation and information provision without additional processing steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of information

If information is added to the functional layer using separate processing steps, then information can be provided to the component, but manufacturing time increases and production efficiency decreases

Engineering Contradiction:
Improveinformation provisionVSAvoidmanufacturing efficiency
Core Design Contradiction:
Loss of informationVSProductivity

Solution Approach 1:

The patent merges the information marking process with the functional layer formation process into a single simultaneous operation. The marking material is applied in the same manufacturing step that forms the functional layer, eliminating the need for separate information addition steps and thereby maintaining high production efficiency while providing component identification information.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The functional layer is designed to serve multiple functions simultaneously: it provides the necessary functional properties (such as electromagnetic shielding or insulation) and also carries identification information for component tracking and assembly. This multi-functionality is achieved by integrating the marking function directly into the layer formation process without compromising either function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Loss of information

If separate information marking layers are added to the component, then information can be stored, but component thickness increases affecting miniaturization

Engineering Contradiction:
Improveinformation storageVSAvoidcomponent thickness
Core Design Contradiction:
Loss of informationVSLength of stationary object

Solution Approach 1:

The information marking is merged into the functional layer itself rather than being added as a separate layer. The marking material is applied during the same process that forms the functional layer, so no additional thickness is required beyond what is necessary for the functional layer's primary purpose.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The marking material is applied locally to specific regions of the functional layer where information needs to be stored, rather than requiring a complete separate layer. This localized approach allows information encoding within the existing layer structure, maintaining thin profile while providing identification capability.

Inventive Principle:
Principle #3Local quality

3Loss of information

If additional processing steps are used to add information, then information can be provided, but manufacturing cost increases

Engineering Contradiction:
Improveinformation additionVSAvoidmanufacturing cost
Core Design Contradiction:
Loss of informationVSEase of manufacture

Solution Approach 1:

The patent combines the information marking operation with the functional layer formation operation into a single manufacturing step. This integration eliminates the need for additional equipment, materials, and process steps that would be required for separate information marking, thereby reducing overall manufacturing cost while still providing component identification.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The marking material is applied in advance during the functional layer formation process, before the component undergoes subsequent manufacturing steps. This preliminary action ensures that information is already present on the component without requiring additional processing steps later in the manufacturing sequence.

Inventive Principle:
Principle #10Preliminary action

4Loss of information

If separate information layers are formed, then information can be marked, but the component requires additional machining which may cause yield loss

Engineering Contradiction:
Improveinformation markingVSAvoidyield loss from machining
Core Design Contradiction:
Loss of informationVSReliability

Solution Approach 1:

The information marking is merged into the functional layer formation process, eliminating the need for separate machining operations. Since the marking is applied during the same process that forms the functional layer, no additional machining steps are required, thereby preventing yield loss from machining residues or process variations.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20240155769A1Method for forming functional layer, method for manufacturing electronic component, and electronic component including functional layer
Publication Date: 2024.05.09 RICOH CO LTD
  • US20240155769A1 patent drawing
  • US20240155769A1 patent drawing
  • US20240155769A1 patent drawing

AI summary

A method for forming a functional layer includes giving information to the functional layer while forming the functional layer on a surface of an object. The functional layer includes an information area having the information and a non-information area other than the information area. The information area is different in color from the non-information area.