Functional Panel Bending with Compressive Stress

Solution Overview

Problem

Portable data processors are prone to damage from accidental drops due to applied forces, and existing display devices with high adhesiveness between layers do not adequately address the issue of structural integrity and convenience.

Innovation Solution

A functional panel design featuring a first plane, a second plane, and a neutral plane with a functional layer having a portion of its thickness greater than or equal to half of the total thickness, supported by a structure that allows bending with compressive stress applied to the functional layer, enhancing durability and convenience.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the functional layer is made thicker to improve structural integrity, then the panel becomes more durable, but the device size and weight increase

Engineering Contradiction:

Improvestructural integrityVSAvoidpanel weight

Core Design Contradiction:

StrengthVSWeight of moving object

Solution Approach 1:

The patent applies local quality by making the functional layer thicker only in the first region where compressive stress is needed for bending, while keeping it thinner in the second region. This localized thickness variation provides structural integrity where required without unnecessarily increasing overall panel weight.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the thickness parameter of the functional layer differently in different regions. By setting the thickness to be greater than or equal to half the total thickness in the first region and less than half in the second region, the patent optimizes the balance between structural integrity and weight reduction.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If the functional layer is made thicker to improve durability, then the panel resists damage better, but the flexibility and ease of bending decrease

Engineering Contradiction:

ImprovedurabilityVSAvoidflexibility

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent applies local quality by making the functional layer thicker only in the first region where compressive stress is needed for bending, while keeping it thinner in the second region. This localized thickness variation provides structural integrity where required without unnecessarily increasing overall panel weight.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the thickness parameter of the functional layer differently in different regions. By setting the thickness to be greater than or equal to half the total thickness in the first region and less than half in the second region, the patent optimizes the balance between structural integrity and weight reduction.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If a uniform thick functional layer is used, then manufacturing is simpler, but the ability to withstand compressive stress during bending is reduced

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidcompressive stress resistance

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent applies local quality by making the functional layer thicker only in the first region where compressive stress is needed for bending, while keeping it thinner in the second region. This localized thickness variation provides structural integrity where required without unnecessarily increasing overall panel weight.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent segments the functional layer into different thickness regions - a first region with greater thickness (greater than or equal to half the total thickness) and a second region with lesser thickness (less than half the total thickness). This segmentation allows each region to be optimized for its specific functional requirements.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enables the functional panel to be bent with the first plane inside, applying compressive stress to the functional layer, thereby enhancing its structural integrity and convenience, making it more reliable and adaptable for portable use.

Implementation Method 1

the functional panel can be bent with the first plane inside such that compressive stress is applied to the portion of the functional layer

Methodology Applied

Scientific EffectCompressive stress: Compression

Data Source

PatentUS20250103156A1Functional panel, device, and data processor

Publication Date: 2025.03.27 SEMICON ENERGY LAB CO LTD

AI summary

A novel functional panel, a novel device, or a novel data processor is provided. A structure in which a first plane, a second plane that is opposite the first plane, and a neutral plane between the first plane and the second plane are provided and a portion of a functional layer having a thickness greater than or equal to half of the thickness of the functional layer is in a region between the first plane and the neutral plane was conceived.