Functional Panel Terminal with Palladium Layer for Impurity Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing functional panels, such as display and light-emitting panels, face issues with reliability due to deterioration from impurities like water and electrical failures at terminal portions, which current technologies fail to adequately address.
Innovation Solution
A functional panel structure is proposed, featuring a first and second substrate bonded with a bonding layer, a protective layer covering the substrates and bonding layer, and a terminal with a conductive material having a lower ionization tendency, such as palladium or gold, to prevent impurity diffusion and electrical failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional terminal structures are used in functional panels, then manufacturing is simpler, but electrical failures occur due to impurity diffusion and oxidation
Solution Approach 1:
The terminal structure uses a composite material system consisting of a first terminal layer (conductive material), a second terminal layer (protective material with lower ionization tendency such as palladium, iridium, gold, or platinum), and an insulating layer. This composite structure provides both electrical conductivity and protection against impurity diffusion and oxidation, resolving the contradiction between reliability and complexity.
Solution Approach 2:
The second terminal layer is specifically designed to have a lower ionization tendency than hydrogen, creating an inert protective environment for the underlying conductive terminal layer. This prevents oxidation and impurity diffusion by establishing a chemically stable barrier, thereby improving electrical reliability without requiring complex external protective mechanisms.
2Reliability
If the terminal is fully covered with protective layer, then impurity diffusion is prevented, but electrical connection is compromised
Solution Approach 1:
The protective configuration is applied locally rather than uniformly. The insulating layer and second terminal layer provide protection in regions where impurity diffusion is a concern, while the first terminal layer remains exposed or accessible in regions requiring electrical connection. This localized application of protective measures maintains both reliability and ease of operation.
Solution Approach 2:
The terminal structure is segmented into multiple functional layers: the first terminal layer for electrical conduction, the second terminal layer for chemical protection, and the insulating layer for electrical isolation and additional protection. This segmentation allows each layer to perform its specific function optimally, with the protective layers preventing impurity diffusion while the conductive layers maintain electrical connection capability.
3Reliability
If bonding layer is exposed, then manufacturing is simpler, but deterioration occurs due to impurity exposure
Solution Approach 1:
The protective layer structure (including the insulating layer and second terminal layer) is formed in advance to cover and protect the bonding layer before the panel is subjected to operational conditions that would cause impurity exposure. This preliminary protective action prevents deterioration from the outset, ensuring long-term durability of the bonding layer without requiring complex post-manufacturing protective measures.
Data Source
AI summary
A functional panel is provided. The functional panel includes a first substrate, a second substrate, a bonding layer, a functional element, a protective layer, and a terminal. The bonding layer is positioned between the first and second substrates. The functional element is surrounded by the first substrate, the second substrate, and the bonding layer. The terminal is electrically connected to the functional element and provided not to overlap with one of the first and second substrates. The protective layer is provided to be in contact with side surfaces of the first and second substrates and an exposed surface of the bonding layer. A surface of the terminal is partly exposed without being covered with the protective layer. The surface of the terminal partly includes a material having a lower ionization tendency than hydrogen.