Functional Printing Conductive Pattern Deposition
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Solution Overview
Problem
Current methods for functional printing lack accuracy in depositing patterns of functional materials on substrates, particularly in creating conductive lines through efficient diffusion and bonding of chemical elements, which is crucial for various electronic applications.
Innovation Solution
The method employs thermal writing devices, such as laser or thermal transfer heads, to form thermal patterns on substrates, combined with a chemical environment, including functional gases, to create patterns of functional chemical traces, enabling precise deposition of materials like copper traces through electro-less deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If direct printing of functional inks is used, then functional patterns can be printed on substrates, but the accuracy of deposition is insufficient
Solution Approach 1:
The process is divided into distinct stages: first forming a thermal pattern on the substrate, then selectively depositing functional material only in the heated regions. This segmentation allows precise spatial control of deposition, improving accuracy while keeping each individual step relatively simple.
Solution Approach 2:
The substrate is pre-heated in specific patterns before material deposition occurs. This preliminary thermal treatment creates regions with enhanced diffusion and bonding properties, ensuring that when functional material is applied, it deposits accurately only where needed, thereby improving deposition precision.
2Manufacturing precision
If photolithography is used to mask and remove pre-deposited functional layer, then functional patterns can be created, but the process becomes more complex and time-consuming
Solution Approach 1:
Instead of depositing material everywhere and then removing unwanted portions (subtractive approach), the invention uses the opposite approach: it activates only the regions where material should be deposited through thermal treatment, then applies material selectively to those activated regions. This inverts the traditional workflow, reducing both time and complexity while maintaining pattern accuracy.
3Manufacturing precision
If thermal writing devices are used to form thermal patterns, then accurate deposition of functional material is achieved, but energy consumption increases
Solution Approach 1:
The thermal energy is applied locally only to the specific regions where functional material needs to be deposited, rather than heating the entire substrate uniformly. This localized thermal treatment achieves the required deposition accuracy while minimizing overall energy consumption by concentrating energy only where it is needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate and efficient formation of conductive lines and patterns on substrates, enhancing the capability for functional printing applications by ensuring precise diffusion and bonding of chemical elements, suitable for various electronic devices.
Implementation Method 1
As the temperature of the substrate increases in a certain position, it allows faster diffusion of chemical elements or allows the attachment of chemical elements to its surface
Implementation Method 2
The gas molecules are diffused towards the laser heated substrate to create a chemical compound between the gas and the material deposited on the surface of the substrate
Implementation Method 3
Another use is to form a pattern of a catalyst material that can be used for electro-less deposition of metal such as copper, and thus manufacture copper traces on the substrate
Data Source
AI summary
A method for forming a conductive pattern on a substrate (208) includes providing an image pattern for imaging on the substrate; imaging the image pattern on the substrate creating imaged areas; spraying functional material (232) on the substrate that diffuse molecules of the functional material into the imaged areas; and applying electro-less copper coating that build conductive material traces on the imaged areas on the substrate.