Functionalized Powder Particles Nanowire Fabrication
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Solution Overview
Problem
Existing nanowire fabrication methods require expensive high-temperature and high-vacuum environments, limiting substrate size, scalability, and production throughput, and are typically restricted to high-purity, monocrystalline silicon wafers with limited applications due to their flat, rigid shape.
Innovation Solution
A method for forming structures, including nanowires, on semiconductor or insulator powder particles, which involves providing powder particles, optionally removing surface contaminants and oxides, and forming structures such as pores, pits, craters, or nanowires on the particles, resulting in homofunctionalized or heterofunctionalized powder particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature and high-vacuum environments are used for nanowire fabrication, then nanowire structures can be formed on substrates, but the cost increases and scalability is limited
Solution Approach 1:
The patent changes the physical and chemical parameters of the fabrication process by using solution-based chemistry at room temperature instead of high-temperature vapor phase processes. This involves changing from vacuum environment to ambient atmosphere, from thermal energy to chemical energy, enabling scalable production while maintaining nanowire formation quality
Solution Approach 2:
The patent replaces the mechanical/thermal system (high-temperature heating, vacuum pumps) with a chemical system (solution-based etching, ambient pressure processing). This substitution eliminates expensive equipment requirements and enables simple, scalable manufacturing processes
2Reliability
If high-purity monocrystalline silicon wafers are used, then nanowire structures can be formed, but the substrate cost increases and applications are limited due to flat, rigid shape
Solution Approach 1:
The patent makes the nanowire fabrication process universal by demonstrating it works on diverse substrate types including polycrystalline silicon, amorphous silicon, and various powder particles. The solution-based process can be applied to flat, curved, and particulate substrates, expanding applications beyond traditional rigid wafers to include flexible and three-dimensional structures
Solution Approach 2:
The patent segments the substrate from the traditional continuous wafer form into discrete powder particles. This segmentation enables new applications where nanoparticulate materials with surface nanowires are desired, such as in composite materials, coatings, and devices requiring high surface area to volume ratios
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of nanostructures on powder particles without the need for expensive high-temperature and high-vacuum environments, allowing for greater scalability and flexibility in substrate size and shape, and enabling applications beyond traditional silicon wafers.
Implementation Method 1
At least one of the forming of (d) and (e) may comprise metal-assisted chemical etching, wherein the metal-assisted chemical etching comprises depositing metal ions on a surface of the powder particle and etching the powder particle by exposing the metal ions to an etchant
Implementation Method 2
In some embodiments, each of the forming of (d) and (e) independently comprises a process selected from the group consisting of metal-assisted chemical etching and chemical etching
Data Source
AI summary
The present disclosure provides functionalized powder particles and methods of forming functionalized powder particles. The functionalization is acquired through the formation of primary and/or secondary structures on a powder particle. Functionalization can be controlled to bring about changes in a broad range of physical and/or chemical properties.