Fungicidal Paste With Silica Hydrogel for Plant Surface Adhesion
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Solution Overview
Problem
Existing copper-based fungicides face challenges with adhesion to plant surfaces, leading to reduced efficacy due to weather conditions, environmental dispersion, and high production costs, necessitating frequent applications and additional technological processes.
Innovation Solution
A fungicidal paste composed of basic copper carbonate, silica hydrogel, and microelements (cobalt, manganese, magnesium, iron, zinc) is produced by precipitating copper from oxidized copper ore, enhancing adhesion and providing long-lasting protection with reduced energy costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper-based fungicides are used to protect plants from fungal diseases, then fungicidal efficacy is improved, but adhesion to plant surfaces is reduced due to weather conditions and environmental dispersion
Solution Approach 1:
The patent combines copper compounds with adhesive substances and substances enhancing fungicidal properties to create a composite fungicide formulation. This composite structure improves adhesion to plant surfaces while maintaining copper's fungicidal efficacy, resolving the contradiction between efficacy and adhesion stability.
Solution Approach 2:
The patent introduces adhesive substances as intermediaries between the copper-based fungicide and plant surfaces. These intermediaries facilitate better attachment and reduce environmental dispersion, allowing the copper compound to maintain contact with the plant surface under weather conditions.
2Reliability
If additional technological processes are used to enhance fungicidal properties and adhesion, then product performance is improved, but production costs and energy consumption increase
Solution Approach 1:
The patent merges multiple functions (adhesion enhancement, fungicidal property enhancement, and copper compound formation) into a single integrated formulation process. This reduces the number of separate technological processes needed, thereby lowering production energy costs while maintaining product performance.
Solution Approach 2:
The patent develops a multi-functional formulation that simultaneously provides adhesion, enhances fungicidal properties, and maintains copper compound stability. This multi-functionality eliminates the need for separate additive processes, reducing overall energy consumption while improving product reliability.
3Reliability
If copper compounds are used in fungicide formulations, then fungicidal activity is improved, but environmental dispersion and removal of copper increase
Solution Approach 1:
The patent uses adhesive substances as intermediaries that bind copper compounds to plant surfaces, reducing environmental dispersion. These intermediaries act as barriers that prevent copper from being washed away by rain or wind, thereby reducing harmful environmental factors while maintaining fungicidal activity.
Solution Approach 2:
The patent employs substances that enhance fungicidal properties and adhesion as temporary, consumable additives that degrade or dissipate after serving their function. This approach allows the copper compound to remain bound to the plant surface during the critical fungicidal action period, then naturally decomposes, minimizing long-term environmental persistence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The paste maintains effective plant coverage, reduces environmental dispersion, lowers production costs, and increases fungicidal efficiency by up to 40% compared to existing formulations, while requiring fewer applications.
Implementation Method 1
The present invention increases the adherence of the fungicide to the target plant
Implementation Method 2
basic copper carbonate formed by precipitation with sodium carbonate from acidic solution
Data Source
AI summary
The present invention is a fungicidal paste and method of controlling fungal disease in plants which provides effective application, enhanced adhesion to the plant matter. The fungicidal paste is composed of highly concentrated aqueous suspension of basic copper carbonate with copper content 25-35% w/w (water content 30-50% w/w) with an addition of adhesive substance and microelements.