Furan-Modified Resin for Recyclable PCBs
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Solution Overview
Problem
Conventional electronic product recycling, particularly of printed circuit boards (PCBs), faces challenges in efficiently recycling thermosetting polymer-based materials due to low recycling ratios and high CO2 emissions, as these materials are difficult to recycle and incineration contributes to greenhouse gas emissions.
Innovation Solution
Development of furan-modified compounds and oligomers with specific structural formulas that enable reversible cross-linking reactions, allowing for the formation of recyclable resin compositions with improved thermal stability and recyclability, suitable for high-temperature environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermosetting polymer resin systems are used in PCBs, then stable properties and flame resistance are achieved, but recyclability deteriorates and CO2 emissions increase
Solution Approach 1:
The patent modifies the chemical structure of thermosetting polymers by introducing furan rings and other functional groups that enable reversible cross-linking. This changes the fundamental parameter of bond permanence, allowing the material to transition from irreversible to reversible cross-linking, thereby achieving both stability during use and recyclability through controlled bond reversal at elevated temperatures.
Solution Approach 2:
The invention creates composite resin systems combining conventional thermosetting polymer backbones with furan-modified cross-linking structures. This composite approach integrates the stability of traditional thermosets with the recyclability of thermally-reversible cross-links, achieving a dual-function material system that satisfies both reliability and ease of recycling requirements.
2Ease of manufacture
If thermoplastic polymer is used to improve recyclability, then recyclability is improved, but glass transition temperature, thermal cracking temperature, and flame resistance deteriorate
Solution Approach 1:
The patent fundamentally changes the thermal behavior parameter by introducing thermally-reversible cross-linking mechanisms. The furan-modified structures maintain cross-link integrity at service temperatures (preserving high Tg and thermal stability) but undergo controlled reversal at recycling temperatures, effectively decoupling the temperature requirements for operational stability and recyclability.
Solution Approach 2:
The invention introduces dynamic, temperature-dependent cross-linking behavior to the resin system. The cross-links remain static and stable during normal operation but become dynamic and reversible at elevated temperatures, allowing the material to adapt its properties based on operational conditions versus recycling conditions.
3Use of energy by moving object
If waste PCBs are incinerated to recover energy, then energy recovery is achieved, but CO2 emissions and greenhouse gas contribution increase
Solution Approach 1:
The patent enables selective recovery of resin components from PCBs through thermal reversal of cross-links. The depolymerized resin can be recovered, purified, and reused as raw material for new PCB manufacturing, creating a circular economy approach that replaces incineration with material recovery, thereby eliminating CO2 emissions associated with both incineration and virgin material production.
Solution Approach 2:
The invention facilitates the recovery and reuse of resin materials through controlled thermal degradation that reverses cross-links without complete combustion. This allows the resin to be recovered in a usable form for remanufacturing, transforming the waste stream from a source of emissions into a recoverable resource.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The furan-modified compounds and oligomers facilitate the creation of recyclable resin compositions with high thermal resistance and reversible cross-linking capabilities, enabling efficient recycling and reuse, thereby reducing CO2 emissions and improving recycling ratios of PCBs and other high-temperature products.
Implementation Method 1
furan-modified compounds and oligomers with specific structural formulas that enable reversible cross-linking reactions, allowing for the formation of recyclable resin compositions with improved thermal stability
Data Source
AI summary
The invention provides a furan-modified compound or oligomer. The compound has a structure represented by Formula I:When formula I represents a compound, x is an integer of 1˜5; A including a group formed of ketone, amido, imide, imido, phenyl ether or enol ether group; G is a direct bond, —O—, —N—, —Ar—NH—(CH2)b—, —Ar—O—(CH2)b—, —Ar—O—(CH2)a—NH—(CH2)b—, —(CH2)a—NH—(CH2)b—, —(CH2)a—O—(CH2)b— or —(CH2)a—CH(OH)—(CH2)b—NH—; Ar is substituted or unsubstituted arylene group; a is an integer of 1 to 5; and b is an integer of 0 to 5.