Furnace Temperature Meter Layout for Seamless Thermocouple Switching

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in maintaining stable temperature control when thermocouples fail, leading to discrepancies in temperature measurement and control due to differing measurement points between primary and backup thermocouples.

Innovation Solution

A configuration involving a protection pipe with dual temperature sensors, where heater and overheat detection thermocouples are positioned closely together within the pipe, and cascade thermocouples measure the object's temperature, ensuring consistent temperature feedback even when primary sensors fail.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If backup thermocouples are arranged relatively close to primary thermocouples, then switching between thermocouples becomes easier, but measurement point discrepancy remains causing temperature control instability

Engineering Contradiction:
Improvethermocouple switching reliabilityVSAvoidtemperature measurement accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent merges the primary and backup thermocouple measurement points by positioning both thermocouples' sensing elements at the exact same location. This is achieved by having both thermocouple wires extend through the same protective tube and terminate at the same measurement point, eliminating spatial separation between primary and backup sensors while maintaining the ability to switch between them for fail-safe operation.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If thermocouples are positioned at different measurement points, then temperature distribution can be monitored, but switching between thermocouples causes temperature control discrepancy

Engineering Contradiction:
Improvetemperature monitoring capabilityVSAvoidtemperature control accuracy
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent introduces a common protective tube as an intermediary structure that houses both primary and backup thermocouples. This protective tube serves as a shared medium that allows both thermocouples to access the same measurement environment while being protected, enabling both temperature monitoring capability and accurate temperature control by eliminating measurement point separation.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If multiple thermocouples are installed for fail-safe operation, then system reliability improves, but device complexity increases

Engineering Contradiction:
Improvetemperature control reliabilityVSAvoidthermocouple system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent makes the thermocouple system universal by designing both primary and backup thermocouples with identical structural characteristics and measurement point locations. This unified design allows either thermocouple to function independently for both monitoring and control purposes, simplifying the overall system architecture while maintaining fail-safe reliability through redundancy.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables continuous and stable temperature control by minimizing position-related measurement discrepancies, allowing seamless switching between thermocouples and maintaining precise temperature regulation.

Implementation Method 1

a thermocouple (also referred to as a 'heater thermocouple' or a 'spike thermocouple') is arranged in the vicinity of the heater to measure a temperature of a heating structure such as the heater

Methodology Applied
Scientific EffectSeebeck effect: Seebeck Effect

Data Source

PatentUS20250239472A1Substrate processing apparatus, method of manufacturing semiconductor device, temperature meter and heater unit
Publication Date: 2025.07.24 KOKUSAI DENKI KK
  • US20250239472A1 patent drawing
  • US20250239472A1 patent drawing
  • US20250239472A1 patent drawing

AI summary

According to one aspect of the technique, there is provided a configuration including: a furnace body covering a reaction chamber; a heating element divided into zones and provided in the furnace body; first temperature sensors provided for the zones such that its temperature measuring point is arranged near the heating element; second temperature sensors provided such that its temperature measuring point is provided close to a temperature measuring point of a first temperature sensor; and temperature meters provided at the zones to hold the temperature measuring points of the first and the second temperature sensors to be close to each other in a protection pipe. Each temperature meter penetrates an outer periphery of the furnace body perpendicular to a central axis of the reaction chamber such that a front end of the protection pipe is located outside the reaction tube and on a tube axis thereof.