L-Shaped Fuse Block Busbar Alignment for PCB Miniaturization

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Solution Overview

Problem

Existing electric connection boxes with fuse blocks require larger printed circuit boards due to the arrangement of busbars and fuses, which limits miniaturization.

Innovation Solution

The fuse block design features L-shaped busbars with tuning-fork and board connecting portions arranged in a specific configuration, where the board connecting portions are aligned in fewer rows than the layers of tuning-fork connecting portions, reducing the mounting area on the printed circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the board connecting portions are arranged in separate rows for each layer of tuning-fork connecting portions, then the connection reliability is improved, but the printed circuit board area increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidprinted circuit board area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the arrangement of board connecting portions across multiple layers by aligning them in the same row. Specifically, board connecting portions from different layers (e.g., first layer and second layer) are positioned in the same row on the printed circuit board, reducing the total number of rows needed and thereby minimizing the board area while maintaining all necessary connections.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the vertical dimension (layer stacking) to accommodate multiple tuning-fork connecting portions while compressing the horizontal footprint. By arranging board connecting portions from different layers in the same row and aligning them with tuning-fork connecting portions in different layers, the design transforms a two-dimensional expansion problem into a three-dimensional space utilization solution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If the number of rows with board connecting portions is increased to match the number of layers with tuning-fork connecting portions, then the manufacturing simplicity is improved, but the device size increases

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidelectric connection box volume
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent combines multiple board connecting portions from different layers into the same row on the printed circuit board. This merging reduces the total row count from matching the layer count to fewer rows, thereby reducing the PCB area and consequently the electric connection box volume, while the manufacturing process remains straightforward through standardized soldering.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a nested arrangement where board connecting portions from different layers are positioned to align vertically, creating a nested pattern when viewed from different perspectives. This nesting allows multiple connection points to share the same horizontal space, reducing the overall footprint without complicating the manufacturing process.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS9004926B2Fuse block and electric connection box having the same
Publication Date: 2015.04.14 YAZAKI CORP
  • US9004926B2 patent drawing
  • US9004926B2 patent drawing
  • US9004926B2 patent drawing

AI summary

For providing a fuse block in which a printed circuit board can be miniaturized, the fuse block includes a plurality of busbars formed into an L-shape. Each of the busbars is provided at one end thereof with at least one tuning-fork shaped connecting portion to be connected with a fuse, and at the other end thereof with at least one board connecting portion to be connected with a printed circuit board by soldering. The busbars are arranged in parallel along a direction X and overlapped along a direction Y to form four layers. The board connecting portion of the busbar in a third layer numbered from the printed circuit board and the board connecting portion of the busbar in a second layer are arranged in one row on one straight line, so that total number of the rows is smaller than total number of the layers.