Fuse Structure With Dummy Electrode For Regrowth Prevention
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Solution Overview
Problem
In semiconductor device manufacturing, existing fuse structures for defective cell replacement are inefficient due to the need for additional processes and lack of reliability in cutting and regrowth prevention of fuse conductive films.
Innovation Solution
A fuse structure comprising first and second lower electrode patterns, a dummy electrode pattern, an insulation layer, and a conductive film with a U-shaped profile, where the conductive film has lower conductivity and is surrounded by dummy conductive film patterns and a moisture absorption preventing film, allowing for simultaneous formation with storage capacitors without additional processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional fuse structure is used for defective cell replacement, then the fuse can be cut to replace defective cells, but additional manufacturing processes are required and reliability in cutting and regrowth prevention is insufficient
Solution Approach 1:
The fuse structure is merged with the storage capacitor structure by sharing common electrodes. The first electrode serves as both a fuse electrode and a storage capacitor electrode, and the second electrode serves as both a fuse electrode and a storage capacitor electrode. This integration eliminates the need for separate fuse structures and reduces manufacturing process complexity while improving reliability through a unified design.
Solution Approach 2:
The electrodes in the fuse structure are designed to serve multiple functions. The first and second electrodes function simultaneously as fuse electrodes for cutting operations and as storage capacitor electrodes for energy storage. This multi-functionality reduces the number of additional manufacturing processes required while enhancing the overall reliability of the device.
2Reliability
If additional processes are added to improve fuse cutting and regrowth prevention, then reliability is enhanced, but manufacturing complexity and time increase
Solution Approach 1:
The fuse formation process is merged with the storage capacitor formation process. Both structures are created simultaneously using the same manufacturing steps, including electrode deposition, insulation layer formation, and conductive film deposition. This integration eliminates additional manufacturing processes and maintains high production throughput while ensuring reliable fuse cutting and regrowth prevention.
Solution Approach 2:
The fuse structure is designed with preliminary features that prevent regrowth before manufacturing issues arise. The insulation layer and conductive film configuration are established during normal manufacturing, creating inherent regrowth prevention mechanisms that do not require additional post-processing steps, thereby maintaining productivity while enhancing reliability.
3Ease of manufacture
If a simple fuse structure is used, then manufacturing is easier, but regrowth prevention and reliability are insufficient
Solution Approach 1:
The fuse structure is combined with the storage capacitor structure, allowing both to be formed using the same manufacturing processes. This merging maintains ease of manufacture by utilizing existing process steps while incorporating reliability-enhancing features such as insulation layers and conductive film configurations that prevent regrowth.
Solution Approach 2:
An insulation layer is introduced as an intermediary between the electrodes and the surrounding environment. This insulation layer serves as a mediator that prevents direct contact and potential regrowth while maintaining the electrical functionality of the fuse structure. The conductive film is also designed as an intermediary element that controls current flow and prevents unwanted regrowth paths.
Data Source
AI summary
A fuse structure, an e-fuse including the fuse structure and a semiconductor device including the e-fuse are disclosed. The fuse structure includes first and second electrodes extending in a first direction, and spaced a predetermined distance apart from each other and having one ends thereof facing each other, an insulation layer formed between the one end of the first electrode and the one end of the second electrode facing each other, and a conductive film overlapping portions of the first and second electrodes on the insulation layer and contacting the first electrode and the one end of the second electrode.


