Fuse Film Adhesion via Laser Sintering
Solution Overview
Problem
Existing fuse production methods face challenges in achieving strong adhesion between the fuse film and the substrate, leading to peeling issues due to thermal expansion differences, especially in smaller fuses, which increases costs and requires expensive equipment for oxygen concentration adjustment.
Innovation Solution
A method involving the formation of a liquid film with metal nanoparticles on a substrate, followed by laser irradiation to melt or sinter the nanoparticles and soften the substrate, creating a fused bond with entering parts to enhance adhesion, and forming fuse films with specific thickness and width adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the surface roughness of the contact interface is reduced to 100 nm or less to improve adhesion, then the bonding strength between fuse film and substrate is enhanced, but the manufacturing cost increases significantly
Solution Approach 1:
The invention changes the surface roughness parameter from the conventional requirement of ≤100 nm to a new range of 100-500 nm, demonstrating that adhesion can be maintained or improved at lower costs by optimizing within this new parameter range. This resolves the contradiction by finding an alternative parameter setting that achieves the same technical effect without the high manufacturing cost.
2Strength
If oxygen concentration is adjusted to 20-2000 ppm to improve adhesion, then the bonding between insulating resin layer and metal thin film is enhanced, but expensive equipment is required
Solution Approach 1:
The invention changes the oxygen concentration parameter from the conventional range of 20-2000 ppm to a new range of 0.1-5% (100-5000 ppm), achieving improved adhesion without requiring expensive oxygen concentration control equipment. This resolves the contradiction by finding an alternative parameter range that can be achieved with simpler, less expensive equipment.
3Weight of moving object
If the fuse size is reduced to achieve downsizing, then the weight and dimensions are reduced, but the adhesion between fuse film and substrate becomes weaker
Solution Approach 1:
The invention changes the surface roughness parameter to 100-500 nm, which enhances adhesion strength even in miniaturized fuses. This allows the fuse to be downsized while maintaining or improving bonding strength, resolving the contradiction between size reduction and adhesion maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method produces fuses with improved resistance to peeling at a lower cost, significantly increasing pulse life and heat cycle reliability while reducing weight and thickness.
Implementation Method 1
heating the liquid film so as to vaporize the solvent to melt or sinter the metal nanoparticles and to soften or melt the principal surface
Implementation Method 2
heating the liquid film so as to vaporize the solvent
Implementation Method 3
melt or sinter the metal nanoparticles
Implementation Method 4
melt or sinter the metal nanoparticles and to soften or melt the principal surface
Implementation Method 5
forming a fuse film on the principal surface by fusing the melted or sintered metal nanoparticles and the softened or melted principal surface with each other
Data Source
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AI summary
[Problem] To produce a fuse whose fuse film is resistant to being peeled from a substrate at a low cost. [Means to solve the problem] A fuse production method includes the steps of forming an ink film 110 of a dispersion liquid, in which metal nanoparticles are dispersed in a solvent, on a surface 102 of a substrate 100 containing at least an organic substance (step S102), heating the ink film 110 so as to vaporize the solvent to melt or sinter the metal nanoparticles and to soften or melt the surface 102 (step S138), and forming a fuse film 120 on the surface 102 by fusing the melted or sintered metal nanoparticles and the softened or melted principal surface with each other (step S140).