Fuse Patterns Electrical Bias Switching Substrate Damage
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Solution Overview
Problem
Conventional semiconductor device repair methods using laser energy to cut fuses can damage the substrate due to high energy density, especially as feature sizes decrease, requiring precise targeting which is challenging with existing technologies.
Innovation Solution
The method involves forming fuse patterns on a semiconductor substrate with specific insulating layers and contact plugs, using an electrical bias to create an electrical short between fuse patterns and contact plugs, effectively switching the fuse state without physical cutting, thus avoiding substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If laser blowing is performed using a laser having higher energy density to accurately target smaller areas, then the precision of fuse cutting is improved, but the substrate is damaged due to transferred laser energy
Solution Approach 1:
The patent introduces an intermediary mechanism (electrical bias application system) between the control system and the fuse cutting process. Instead of directly using laser energy to cut the fuse, the system applies electrical bias to activate the fuse structure, causing it to break through mechanical stress or electrical breakdown. This intermediary approach allows precise targeting without the harmful thermal effects of high-energy laser direct contact.
Solution Approach 2:
The patent replaces the optical/thermal system (laser) with an electrical system for fuse cutting. By applying electrical bias through contact plugs and wires to the fuse patterns, the fuse is activated to break through mechanical deformation or electrical breakdown mechanisms rather than thermal ablation. This substitution eliminates the substrate damage caused by laser energy transfer while maintaining precise control over which fuse is cut.
2Productivity
If feature sizes are reduced to improve device integration, then the storage capacity and speed are improved, but the laser blowing becomes more difficult and substrate damage risk increases
Solution Approach 1:
The patent replaces the laser-based mechanical/optical cutting system with an electrical activation system. The electrical bias application method does not depend on feature size in the same way laser focusing does. The electrical fields can be precisely controlled and applied to specific fuse locations regardless of the overall device scale, making the manufacturing process more scalable and less difficult as feature sizes reduce.
Solution Approach 2:
The patent changes the fundamental parameter of fuse activation from thermal energy (laser) to electrical energy. This parameter change allows the process to be less sensitive to feature size reductions. The electrical bias can be applied with precise control over voltage and current, enabling reliable fuse activation even at smaller scales without the focusing and energy density challenges inherent in laser systems.
3Productivity
If high-energy laser is used to cut fuses, then the fuse cutting effectiveness is improved, but the substrate is damaged due to energy transfer
Solution Approach 1:
The patent substitutes the high-energy laser system with an electrical bias application system. The fuse cutting effectiveness is achieved through electrical activation that causes mechanical failure or electrical breakdown of the fuse structure. This method maintains high effectiveness in terms of reliable fuse cutting while completely eliminating the substrate damage caused by laser energy transfer, as no high-energy radiation is involved.
Solution Approach 2:
The patent converts the potential harm of high-energy application into benefit by using controlled electrical bias. Instead of using harmful laser energy that damages the substrate, the system uses controlled electrical fields that can be precisely localized. The electrical bias can be applied only where needed through the contact plug and wire structure, converting what would be a harmful widespread energy application into a beneficial localized process that achieves fuse cutting without substrate damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate and damage-free switching of fuse states, improving semiconductor device repair efficiency and reducing the risk of substrate damage, while enabling smaller feature sizes without the need for high-energy laser cutting.
Implementation Method 1
a first electrical bias applying pattern (290, 300) coupled to the first fuse through a first switching insulation film (270), wherein the first switching insulation film is broken and the first fuse is coupled to the first electrical bias applying pattern (290, 300) when a first electrical bias is formed between the first fuse (250) and the first electrical bias applying pattern (290, 300)
Implementation Method 2
a laser used should be adjusted to have a smaller wavelength and higher energy density. When the laser blowing is performed using a laser having higher energy density, laser energy radiated is undesirably transferred down to the semiconductor substrate, damaging the substrate
Data Source
AI summary
The present invention provides fuse patterns and a method of manufacturing the same. According to the present invention, an insulating layer and a contact plug are filled between fuse patterns which are formed to have their ends broken and are isolated from each other. In case of a fail cell, the insulating layer is broken owing a difference in an electrical bias (current or voltage) between a metal wire and the fuse patterns, and a short is generated between the fuse patterns. Accordingly, embodiments avoid damage to a semiconductor substrate associated with a conventional fuse repair method employing laser energy, and the area of a fuse box can be reduced.