Fuse Placement for Overcurrent Protection in Miniaturized Semiconductor Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of microSD cards leads to reduced mechanical strength, making them susceptible to damage from external forces, which can result in overcurrent flow and increased temperature due to internal chip or substrate cracks, compromising their reliability.
Innovation Solution
Incorporating a fuse mounted near the power supply terminal, which melts and breaks when an overcurrent exceeds its allowable level, thereby cutting off power supply and preventing further current flow and temperature increase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of microSD card is reduced for miniaturization, then the portability and compactness are improved, but the mechanical strength is reduced making the device more susceptible to damage from external forces
Solution Approach 1:
The fuse is pre-mounted on the substrate in a position that allows it to detect overcurrent conditions before they cause damage to the semiconductor elements. The fuse is strategically positioned near the power supply terminal to intercept excessive current flow before it can harm the mounted components, thus preventing damage in advance
2Object-affected harmful factors
If external force causes internal chip or substrate cracks, then the structural integrity is compromised, but this can result in overcurrent flow and increased temperature
Solution Approach 1:
The fuse acts as an intermediary protective element between the power supply terminal and the semiconductor elements. When cracks occur in the substrate or chips due to external force, the fuse intercepts the resulting overcurrent flow before it can reach and damage the semiconductor elements, thus mediating the harmful effect of structural failures
Solution Approach 2:
The invention converts the harmful effect of overcurrent (which would otherwise damage semiconductor elements) into a beneficial protective mechanism. The fuse is designed to melt and break under overcurrent conditions, transforming the dangerous excessive current into a safe disconnection that prevents further damage to the device
3Area of stationary object
If a fuse is mounted inside the mounting area of semiconductor elements, then the space utilization is improved, but the fuse may interfere with the mounting of semiconductor elements and increase device complexity
Solution Approach 1:
The substrate is functionally segmented into distinct zones: a mounting area for semiconductor elements and a separate area for the fuse near the power supply terminal. This spatial segmentation allows each component to be mounted and connected independently without interference, simplifying the overall assembly process while maintaining efficient space utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of microSD cards by preventing overcurrent and temperature rise in the event of external force-induced damage, ensuring continued functionality and safety.
Implementation Method 1
a fuse mounted on the outside of a mounting area of the plurality of semiconductor elements and mounted on a surface of the substrate near a power supply terminal among the plurality of terminals; and the power supply terminal and the plurality of semiconductor elements are connected via the fuse
Data Source
AI summary
A semiconductor device including a plurality of semiconductor elements, a substrate on which the plurality of semiconductor elements are mounted, the substrate also having a plurality of terminals for connecting to external equipment, a fuse mounted on the outside of a mounting area of the plurality of semiconductor elements and mounted on a surface of the substrate near a power supply terminal among the plurality of terminals, and the power supply terminal and the plurality of semiconductor elements are connected via the fuse.