Fuse Trimming via Substrate Switching for Leakage Control
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Solution Overview
Problem
Existing trimming methods for semiconductor devices face challenges in completely cutting fuse resistors due to high leakage currents, which are often caused by delayed rise times of cutting currents, affecting the accuracy and reliability of electrical characteristic adjustments.
Innovation Solution
The method involves setting switching devices on the semiconductor substrate to a conductive state to direct the cutting current directly to the fuse resistor, bypassing external components that can impede current flow, thereby ensuring a shorter path and faster rise time for the cutting current, allowing for precise cutting of the fuse resistor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the cutting current path is extended through external components, then the circuit design is simplified, but the rise time of the cutting current increases and leakage current occurs
Solution Approach 1:
A dedicated cutting current supply circuit is introduced as an intermediary component to provide cutting current directly to the fuse resistor through the semiconductor substrate. This mediator circuit includes a current supply unit that generates the cutting current and a control unit that manages the timing and path of the current, thereby achieving complete cutting without relying on external components while maintaining circuit simplicity.
Solution Approach 2:
The cutting current path is moved from a planar external circuit path to a vertical path through the semiconductor substrate thickness direction. By utilizing the substrate as a current conduction path in the thickness direction, the invention achieves short current path and fast rise time while keeping all components integrated within the semiconductor device structure.
2Reliability
If the cutting current path is shortened within the semiconductor substrate, then the rise time of the cutting current is reduced and leakage current is minimized, but the circuit design becomes more complex
Solution Approach 1:
The semiconductor substrate is designed to serve multiple functions: it acts as both the structural foundation for mounting circuit components and as a current conduction path for the cutting current. The substrate's thickness direction is utilized as a current path, allowing the same physical structure to fulfill both mechanical support and electrical conduction roles, thereby avoiding additional complex external circuitry.
Solution Approach 2:
The semiconductor device structure itself is designed to provide the cutting current path functionality. The substrate and internal connections are configured to naturally conduct the cutting current from the power supply unit through the fuse resistor, eliminating the need for external trimming circuits or additional current path structures.
3Ease of operation
If external components are used to provide cutting current, then the current path is longer and rise time increases, but the internal circuit structure is simpler
Solution Approach 1:
The cutting current supply circuit is pre-configured within the semiconductor substrate during manufacturing. The current path through the substrate thickness direction is established in advance, with dedicated power supply units and control circuits positioned to immediately deliver cutting current when needed, eliminating the delay associated with external current path establishment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces leakage currents and ensures accurate trimming by shortening the cutting current path, leading to improved electrical characteristic adjustments and reduced risk of damaging adjacent components.
Implementation Method 1
the cutting current flows to the switching device... to cut the fuse resistor
Data Source
AI summary
A trimming method for adjusting electrical characteristics of an adjustment circuit, which is provided in a semiconductor substrate, by cutting a fuse resistor provided in the semiconductor substrate. In a case where a cutting current flows to the fuse resistor to cut the fuse resistor, at least one of switching devices provided in the semiconductor substrate is set to a conductible state to make the cutting current flow to the switching device.