Fused Lead Integrated Circuit Package Reducing PCB Congestion
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Solution Overview
Problem
Modern consumer electronics require increased integrated circuit density in shrinking physical spaces with reduced costs, but existing technologies fail to effectively address the need for higher input and output pin counts without increasing printed circuit board complexity and congestion.
Innovation Solution
A non-leaded integrated circuit package system is developed, featuring a die paddle with a dual row of terminals, selectively fused leads, and extensions that provide additional ground bonding sites and routing flexibility, reducing the need for larger pin counts and footprints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the input and output pin count is increased to meet consumer electronics requirements, then the integrated circuit density is improved, but the printed circuit board complexity and congestion increase
Solution Approach 1:
Multiple inner terminals are selectively fused together to form fused leads, combining multiple signal paths into single consolidated connections. This reduces the total number of discrete terminals that need to be routed on the printed circuit board, thereby reducing PCB complexity and congestion while maintaining the functional connectivity of multiple pins.
Solution Approach 2:
The fused leads serve multiple functions: they provide electrical connectivity for multiple original terminals, establish ground connections, and reduce the overall terminal count. This multi-functionality allows the package to maintain high input/output density without proportionally increasing PCB complexity.
2Quantity of substance
If more integrated circuits are integrated into a package to increase functionality, then the function density is improved, but the package physical space requirements increase
Solution Approach 1:
By fusing adjacent inner terminals together, multiple terminal functions are consolidated into fewer physical connection points. This allows more integrated circuit functions to be packaged in a smaller footprint, as the fused leads reduce the space required for terminal routing and connection infrastructure.
3Area of stationary object
If the package footprint is reduced to save physical space, then the area efficiency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The fusion of adjacent terminals is designed to occur at standardized locations within the lead frame structure. By consolidating multiple terminals into fused leads at predetermined positions, the manufacturing process can use established alignment tolerances and fusion techniques, thereby controlling precision requirements even as the package footprint is reduced.
4Ease of manufacture
If existing manufacturing processes are reused to reduce cost, then the manufacturing cost is improved, but the package dimension reduction is limited
Solution Approach 1:
The terminal fusion process utilizes existing manufacturing capabilities such as laser fusion, ultrasonic welding, or eutectic bonding that are already employed in lead frame fabrication. By applying these established processes to fuse adjacent terminals, the invention achieves dimension reduction without requiring entirely new manufacturing equipment or processes, thereby controlling costs while shrinking package size.
Data Source
AI summary
A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including an outer terminal and an inner terminal, and selectively fusing an inner terminal and an adjacent inner terminal to form a fused lead.