Fusion Bonding Wafer With Infrared Temperature Sensing
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Solution Overview
Problem
Conventional fusion bonding wafers face challenges in accurately detecting temperature during the fusion bonding process of resin tubes.
Innovation Solution
A fusion bonding wafer with a temperature measurement hole that allows for accurate temperature detection through a non-contact infrared thermometer, avoiding interference with the resin tubes and ensuring precise temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional fusion bonding wafer structure is used, then the device structure is simple, but temperature detection accuracy deteriorates
Solution Approach 1:
The wafer is segmented by introducing a temperature measurement hole that divides the wafer body into distinct functional zones: a heating zone with the heating element and a measurement zone through the hole. This segmentation allows the infrared thermometer to measure temperature at a specific location without interfering with the overall wafer structure or heating function.
Solution Approach 2:
The temperature measurement hole acts as an intermediary that enables non-contact temperature measurement. The hole provides a pathway for infrared radiation from the heating element or wafer surface to reach the external infrared thermometer, facilitating accurate temperature detection without direct contact or complex embedded sensors.
2Measurement precision
If temperature measurement components are added to the wafer, then temperature detection accuracy improves, but device complexity increases
Solution Approach 1:
The patent replaces complex embedded temperature sensors with a simpler optical measurement system. Instead of incorporating mechanical or electrical temperature sensors within the wafer structure, the invention uses an infrared thermometer that measures temperature remotely through the measurement hole, substituting a complex mechanical sensing system with a non-contact optical system.
3Measurement precision
If the wafer structure is modified for temperature measurement, then temperature detection capability improves, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct steps: forming the wafer body, creating the temperature measurement hole, and positioning the heating element. This segmentation of the manufacturing process makes each step more manageable and allows for standardized production techniques to be applied to each individual step, reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and reliable fusion bonding of resin tubes by accurately detecting the temperature of the wafer, reducing waiting times and maintaining sterility of the bonding process.
Implementation Method 1
The fusion bonding wafer is equipped with a heating element which is sandwiched between plate-shaped substrates, and the heating element serves to heat the fusion bonding wafer to a predetermined temperature required for fusion bonding
Implementation Method 2
a non-contact infrared thermometer, avoiding interference with the resin tubes and ensuring precise temperature measurement
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
In a fusion bonding wafer (18), a tube fusion bonding device (10), and a tube fusion bonding method, the fusion bonding wafer (18) is equipped with first and second substrates formed in a flat plate shape, a heating element formed between the inner surfaces of the first and second substrates, and a temperature measurement hole (44) that penetrates through the second substrate in a thickness direction thereof and exposes the inner surface of the first substrate. The temperature measurement hole allow temperature in the interior of the fusion bonding wafer (18) to be detected. Ideally, a non-contact sensor, e.g. infrared radiation thermometer (70), detects the temperature of the wafer (18). Advantageously, the wafer is used to cut and weld resin tubes such as those for medical use.