GaAs Surface Oxide Homogeneity for Low-Defect Epitaxy

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Solution Overview

Problem

Conventional processes for producing gallium arsenide substrates do not meet the increasing requirements for subsequent epitaxy processes, particularly in terms of achieving high layer quality and low defect densities in large-area and reliable epitaxial production.

Innovation Solution

A process involving dry oxidation treatment using UV radiation and/or ozone gas, followed by contacting the substrate with a liquid medium and Marangoni drying, to achieve a homogeneous surface oxide layer that can be thermally desorbed in a controlled manner.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional wet chemical cleaning processes are used, then particle and impurity removal is achieved, but surface homogeneity deteriorates due to non-uniform oxide formation and residual contamination

Engineering Contradiction:
Improvesurface homogeneityVSAvoidepitaxy quality
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent replaces conventional wet chemical cleaning (mechanical/chemical process) with UV radiation treatment (electromagnetic radiation process). The UV irradiation treatment uniformly oxidizes the GaAs surface without the non-uniformities caused by liquid media contact, achieving both high surface homogeneity and reliability for subsequent epitaxy processes.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the oxidation conditions by using UV radiation instead of wet chemical methods. The UV irradiation treatment creates a controlled oxide layer with specific thickness and uniformity that cannot be achieved through conventional wet cleaning, thereby improving surface homogeneity while maintaining epitaxy quality.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If thermal desorption is used to remove surface oxides, then clean substrate surface is achieved, but surface roughness increases reducing layer quality

Engineering Contradiction:
Improvelayer qualityVSAvoidsurface roughness
Core Design Contradiction:
Manufacturing precisionVSShape

Solution Approach 1:

The patent applies UV irradiation treatment as a preliminary step before epitaxy to create a uniformly thin oxide layer. This preliminary oxidation prevents the need for aggressive thermal desorption that would cause roughness, as the UV-formed oxide can be more gently removed or serves as a controlled starting layer for epitaxy.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent substitutes thermal desorption (thermal process causing roughness) with UV radiation treatment (electromagnetic process). The UV treatment achieves oxide formation and removal more gently, preserving surface smoothness while achieving the desired clean surface for high-quality epitaxial layers.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If multiple cleaning steps are performed, then particle removal is improved, but process complexity and time increase

Engineering Contradiction:
Improveparticle removal efficiencyVSAvoidcleaning process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple cleaning functions (oxidation, particle removal, surface activation) into a single UV irradiation treatment step. This consolidation achieves the particle removal efficiency of multi-step processes while eliminating the complexity and time requirements of sequential wet chemical treatments.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces complex multi-step wet chemical cleaning sequences with a single UV radiation treatment step. The electromagnetic radiation process simultaneously achieves oxidation, particle removal, and surface preparation that would otherwise require multiple sequential chemical baths and drying steps.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The process results in gallium arsenide substrates with improved surface homogeneity and reduced defect areas, enabling high-quality epitaxial growth and increasing the yield of epitaxial components.

Implementation Method 1

oxidation treatment of at least one surface of the gallium arsenide substrate in dry condition by means of UV radiation

Methodology Applied
Scientific EffectPhoto-oxidation: Photo-oxidation

Implementation Method 2

oxidation treatment of at least one surface of the gallium arsenide substrate in dry condition by means of UV radiation and/or ozone gas

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 3

contacting the at least one surface of the gallium arsenide substrate with at least one liquid medium

Methodology Applied
Scientific EffectChemical cleaning:

Implementation Method 4

Marangoni drying of the gallium arsenide substrate

Methodology Applied
Scientific EffectMarangoni effect: Marangoni Effect

Implementation Method 5

The composition of the oxide layer can be measured for example by means of X-ray-excited photoelectron spectroscopy (XPS)

Methodology Applied
Scientific EffectThermal desorption: Desorption

Data Source

PatentUS12205815B2Gallium arsenide substrate comprising a surface oxide layer with improved surface homogeneity
Publication Date: 2025.01.21 FREIBERGER COMPOUND MATERIALS GMBH
  • US12205815B2 patent drawing
  • US12205815B2 patent drawing
  • US12205815B2 patent drawing

AI summary

A gallium arsenide substrate which exhibits at least one surface having a surface oxide layer comprising gallium and arsenic oxides and which exhibits at least one surface having, according to an ellipsometric lateral substrate mapping with an optical surface analyzer, based on a substrate diameter of 150 mm as reference, a defect number of <6000 and/or a total defect area of less than 2 cm2, wherein a defect is defined as a continuous area of greater than 1000 μm2 having a deviation from the average measurement signal in elipsometric lateral substrate mapping with an optical surface analyzer of at least ±0.05%.