Gallium Barrier Region for Optoelectronic Semiconductor Chip Defect Control

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Optoelectronic semiconductor chips face a reduction in electromagnetic radiation intensity due to defect penetration into the active region, leading to decreased brightness over time, especially when defects form on structured surfaces and are influenced by external electromagnetic radiation.

Innovation Solution

Incorporating a gallium-based barrier region that extends parallel to the active region, acting as a defect diffusion barrier to inhibit the penetration of defects from structured surfaces and other regions, thereby maintaining radiation intensity and brightness over a longer period.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a structured surface is used in the optoelectronic semiconductor chip, then the coupling-out efficiency of electromagnetic radiation is improved, but defects form on the surface and penetrate into the active region, reducing brightness over time

Engineering Contradiction:
Improvecoupling-out efficiency of electromagnetic radiationVSAvoidbrightness stability over time
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

A barrier region is introduced as an intermediary layer between the structured surface and the active region. This barrier region, extending from the structured surface toward the active region, acts as a mediator that allows the structured surface to maintain its radiation coupling efficiency while simultaneously preventing defects from penetrating into the active region, thus resolving the contradiction between improved radiation efficiency and long-term brightness stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Duration of action of moving object

If the optoelectronic semiconductor chip is operated for extended periods, then operational experience and reliability data are gained, but defect penetration increases leading to reduced electromagnetic radiation intensity

Engineering Contradiction:
Improveoperational durationVSAvoidelectromagnetic radiation intensity
Core Design Contradiction:
Duration of action of moving objectVSIllumination intensity

Solution Approach 1:

The barrier region is constructed in advance during the manufacturing process, before the chip enters operation. This preliminary structural preparation creates a protective configuration that proactively prevents defect penetration throughout the operational lifetime of the device, ensuring that electromagnetic radiation intensity is maintained over extended operational periods without degradation from defect accumulation.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The gallium-based barrier region effectively reduces defect diffusion into the active region, maintaining the brightness and intensity of electromagnetic radiation emitted by the optoelectronic semiconductor chip during operation, enhancing its operational efficiency.

Implementation Method 1

Incorporating a gallium-based barrier region that extends parallel to the active region, acting as a defect diffusion barrier to inhibit the penetration of defects from structured surfaces and other regions

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Data Source

PatentUS10886431B2Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip
Publication Date: 2021.01.05 OSRAM OLED
  • US10886431B2 patent drawing
  • US10886431B2 patent drawing

AI summary

An optoelectronic semiconductor chip and a method for producing an optoelectronic semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a p-doped region, an active region configured to emit electromagnetic radiation during operation of the optoelectronic semiconductor chip, an n-doped region, a cover layer and a barrier region. The active region is arranged between the p-doped region and the n-doped region in a vertical direction, wherein the active region is based on a III-V semiconductor compound and the barrier region includes gallium, wherein the barrier region is configured to inhibit penetration of defects into the active region, and wherein the cover layer is arranged on the barrier region, the cover layer having a structured surface.