Gallium Oxide Substrate Cleaving Along (100) Dividing Grooves
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Solution Overview
Problem
Existing methods for dividing β-type gallium oxide substrates with a (001) plane as the main surface face issues such as flaky delamination and chipping due to the non-perpendicular orientation of the (100) cleavage plane, leading to ineffective singulation.
Innovation Solution
Forming first dividing grooves along the extending direction of the (100) plane on the back surface of the substrate, perpendicular to the cleavage plane, and optionally forming second grooves on the element forming surface at a specific angle to ensure accurate cleavage without flaky peeling or chipping, using etching to prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is cleaved along the (100) plane without scratches, then the cleavage surface is smooth, but flaky delamination occurs in areas where no scratches are formed
Solution Approach 1:
The substrate is divided into multiple strips by forming dividing grooves along the (100) plane, creating controlled separation zones that prevent uncontrolled flaky delamination while maintaining smooth cleavage surfaces
Solution Approach 2:
Dividing grooves are formed in advance along the (100) plane before final cleavage, pre-defining the cleavage paths and preventing flaky delamination during the subsequent cleavage process
2Productivity
If dicing is performed along the extending direction of the cleavage surface, then the substrate can be divided into strips, but chipping occurs due to partial cleavage
Solution Approach 1:
The substrate is segmented into strips by forming dividing grooves that extend along the (100) plane, allowing controlled separation that prevents chipping at the edges during the dicing process
Solution Approach 2:
The dividing grooves act as intermediaries that guide the cleavage process, providing a controlled path for separation that prevents uncontrolled chipping at the edges
3Stability of the object's composition
If the (100) plane is not perpendicular to the main surface, then the substrate structure is maintained, but conventional cleavage methods cannot cleave the substrate correctly
Solution Approach 1:
The dividing grooves are formed at a specific angle (76 degrees) relative to the element forming surface, matching the inclined orientation of the (100) plane, thereby accommodating the asymmetric crystal structure while achieving accurate cleavage
Solution Approach 2:
The angle of the dividing grooves is adjusted to 76 degrees relative to the element forming surface, matching the inclination of the (100) plane, which enables correct cleavage while maintaining the substrate's crystal structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for reliable and chip-free singulation of β-type gallium oxide substrates with flat cleavage surfaces, reducing chipping and increasing the yield of usable substrates without requiring processing of the element forming surface.
Implementation Method 1
the first dividing grooves may be formed by etching. This prevents the substrate from being cracked or chipped at the time of forming the first dividing grooves
Data Source
AI summary
To divide a β-type gallium oxide substrate having a (001) plane as a main surface satisfactorily. A method of diving a gallium oxide substrate includes: a step of forming a plurality of dividing grooves along the extending direction of the (100) plane of a β-type gallium oxide substrate having the (001) plane as the main surface; a step of processing the β-type gallium oxide substrate into strips by cutting the substrate in a direction perpendicular to the extending direction of the dividing grooves; and a step of cleaving the strip-shaped β-type gallium oxide substrates 10 along the dividing grooves for singulation. Since the plurality of dividing grooves are thus formed along the cleavage planes, the substrate can be divided satisfactorily without causing flaky peeling on the cleavage surfaces by cleaving the substrate along the dividing grooves.