Galvanic Contact Point Reinforcement for Flexible Implant PCBs
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Solution Overview
Problem
Flexible printed circuit boards used in implants are mechanically sensitive at contact points, leading to loss of electrical contact and inadequate anchoring within the thin, flexible substrate, making them prone to detachment under mechanical loads during production, assembly, or use.
Innovation Solution
The solution involves reinforcing contact points on flexible printed circuit boards with additional material layers, such as through galvanic growth or sputtering, to enhance mechanical stability and anchoring, allowing for more reliable electrical contact and improved anchoring within the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If flexible printed circuit boards with thin conductor tracks are used to minimize dimensions, then the device size is reduced, but the contact points become mechanically sensitive and prone to detachment
Solution Approach 1:
The patent applies different material properties to different regions of the contact point structure. The upper contact point region uses soft, flexible material (gold, copper, or aluminum with specific mechanical properties) to maintain flexibility, while the lower anchoring region uses hard, rigid material (galvanically grown conductor track material) to provide mechanical stability and resistance to detachment forces.
Solution Approach 2:
The contact point is constructed as a composite structure combining multiple materials with different properties: a flexible upper portion made of soft conductive material and a rigid lower portion made of galvanically grown conductor track material. This composite structure integrates the advantages of both flexible and rigid materials to achieve both flexibility and mechanical stability.
2Manufacturing precision
If the conductor track thickness is reduced to a few nanometers to achieve fine dimensions, then the device precision is improved, but the mechanical anchoring of contact points becomes insufficient
Solution Approach 1:
The patent transitions from a two-dimensional thin film structure to a three-dimensional structured contact point with distinct upper and lower regions. The lower region features a widened base with galvanically grown conductor track material that extends into the insulating layer, creating a three-dimensional anchoring structure that provides mechanical strength while maintaining the precision of the upper contact surface.
Solution Approach 2:
The contact point structure employs local quality differentiation where the upper contact surface maintains thin-film precision for electrical contact, while the lower anchoring region develops a three-dimensional structure with increased material volume and mechanical interlocking features to provide strength and resistance to detachment forces.
3Adaptability or versatility
If the printed circuit board is made flexible to improve adaptability, then the device versatility is enhanced, but the contact points become more sensitive to mechanical forces during production and assembly
Solution Approach 1:
The patent applies different mechanical properties to different regions of the contact point. The upper contact point region maintains flexibility to accommodate the flexible nature of the printed circuit board, while the lower anchoring region is designed with high mechanical strength and rigidity to resist detachment forces during production, assembly, and operation.
Solution Approach 2:
The contact point structure incorporates a mechanically reinforced lower region that acts as a cushioning element, absorbing and distributing mechanical stresses and forces before they can reach and damage the thin upper conductor track and contact surface. This pre-reinforcement protects the sensitive upper regions from mechanical damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforcement of contact points results in more stable and reliable electrical connections, reducing sensitivity to mechanical forces and ensuring better anchoring, which is crucial for neuroprosthetic applications and other implant systems.
Implementation Method 1
mechanical reinforcement of the contact pad is achieved by galvanic growth of conductor track material
Data Source
Figure 1
Figure 2a~2b
Figure 3a~3b
AI summary
The object, namely to create a printed circuit board for an implant with improved properties in the electrical contact via the contact points of the conductor tracks on the printed circuit board, is achieved, according to the present invention, by a device for contacting and/or electrostimulation of living tissue cells or nerves, with a printed circuit board having at least one contact point for electrical contact, wherein the printed circuit board comprises a flexible multilayer system with at least one conductor track. According to the invention, the contact points for the conductor track in the multilayer system are galvanically strengthened. For this purpose, a galvanically strengthened layer is grown onto the already preprocessed contact point, for example by a galavanic process. By applying one or more additional material layers onto the contact points of the conductor tracks, the latter are anchored with greater mechanical stability in the printed circuit board and are therefore more reliable in terms of their function.