Galvanic Isolation Circuit Using Near-Field Coupled Micro Antennas

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Solution Overview

Problem

Existing communication systems using galvanic isolation require twice the silicon area for bidirectional half/full duplex communication due to the need for separate physical links, which is inefficient in terms of silicon area usage and complexity.

Innovation Solution

A communication circuit utilizing two near-field-coupled micro antennas and four couples of switches to configure the direction of communication, allowing for half-duplex communication using only one physical link, without requiring external or non-standard components, and suitable for integration with conventional CMOS technology.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate physical links are used for bidirectional communication, then communication reliability is improved, but silicon area occupation doubles

Engineering Contradiction:
Improvecommunication reliabilityVSAvoidsilicon area occupation
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines transmit and receive functions into a single physical link using near-field-coupled micro antennas. The first circuit and second circuit share a common antenna structure that operates in LC resonance, allowing bidirectional communication through one physical interface rather than requiring separate transmit and receive paths. This merging reduces silicon area while maintaining communication reliability through the resonant coupling mechanism.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The micro antenna structure serves multiple functions simultaneously: it acts as both transmit antenna and receive antenna, provides galvanic isolation, and operates at RF carrier frequency. The single physical link is universally capable of handling bidirectional communication without requiring dedicated hardware for each direction, thereby reducing overall component count and silicon area occupation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If separate physical links are used for bidirectional communication, then communication performance is improved, but device complexity increases

Engineering Contradiction:
Improvecommunication performanceVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple communication functions into a unified circuit architecture where transmit and receive operations share common components. The near-field-coupled micro antenna system combines radiation elements, resonant circuits, and switching mechanisms into an integrated structure that reduces device complexity compared to separate physical links while maintaining communication performance through coordinated operation of the merged components.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If conventional CMOS technology is used for integration, then manufacturing ease is improved, but achieving high galvanic isolation and transient immunity becomes difficult

Engineering Contradiction:
Improvemanufacturing easeVSAvoidgalvanic isolation rating
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent achieves high galvanic isolation using conventional CMOS technology by carefully controlling resonant frequency parameters and coupling coefficients of the micro antenna system. The LC resonance conditions are tuned to specific frequencies where near-field coupling provides sufficient signal transfer while maintaining high isolation at other frequencies. This parameter optimization allows standard CMOS processes to achieve isolation ratings and transient immunity previously requiring specialized manufacturing.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient half-duplex communication with reduced silicon area occupation and lower current consumption, achieving higher isolation ratings and common mode transient immunity, while maintaining high galvanic isolation and immunity to common-mode transient disturbances.

Implementation Method 1

A communication circuit utilizing two near-field-coupled micro antennas and four couples of switches to configure the direction of communication

Methodology Applied
Scientific EffectNear-field coupling: Electromagnetic Induction

Implementation Method 2

operating in LC resonance conditions centered at the frequency of a RF carrier

Methodology Applied
Scientific EffectLC resonance: Resonance

Data Source

PatentUS20240333318A1Communication circuit, corresponding system and method
Publication Date: 2024.10.03 STMICROELECTRONICS INT NV
  • US20240333318A1 patent drawing
  • US20240333318A1 patent drawing
  • US20240333318A1 patent drawing

AI summary

A circuit for transmitting/receiving signals through a galvanic isolation comprises an antenna transmitting/receiving radiofrequency signals modulated over a radiofrequency carrier, a transmitter receiving an input data signal, and a receiver delivering an output data signal. First and second capacitive circuitry are arranged between the antenna and the receiver and the transmitter, respectively. First and second switching circuitry couple the first and second capacitive circuitry to the antenna in an inductive-capacitive network, alternately: in a transmission mode, the first switching circuitry couples the first capacitive circuitry to ground with the receiver disabled, and the second switching circuitry decouples the second capacitive circuitry from the inductive-capacitive network with the transmitter enabled, and in a reception mode, the first switching circuitry decouples the first capacitive circuitry from ground, with the receiver enabled, and the second switching circuitry couples the second capacitive circuitry to the inductive-capacitive network with the transmitter disabled.