Galvanic Isolation Die Integrating Planar Transformer for Signal and Power
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Solution Overview
Problem
Existing multi-die chips with galvanic isolation for both signal and power paths are bulky and expensive due to the use of toroidal transformers, which are costly to manufacture and attach.
Innovation Solution
A semiconductor structure with a galvanic isolation die that integrates a transformer structure for power transfer and signal structures, using non-conductive materials like silicon nitride and silicon dioxide to prevent copper diffusion and parasitic coupling, allowing for a compact and cost-effective design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If toroidal transformers are used for galvanic isolation of power paths, then galvanic isolation is achieved, but the device becomes bulky and expensive
Solution Approach 1:
The patent combines the power transformer and signal capacitor into a single integrated structure where the same high-voltage and low-voltage coils serve both power transfer and signal isolation functions. This eliminates the need for separate toroidal transformers and external capacitors, reducing overall device size while maintaining galvanic isolation for both power and signal paths.
Solution Approach 2:
The high-voltage and low-voltage coils are designed to perform multiple functions simultaneously: they transfer power through inductive coupling and provide galvanic isolation for signal paths through capacitive coupling. This multi-functionality eliminates the need for dedicated separate components for each function, reducing device complexity and size.
2Reliability
If toroidal transformers are used for galvanic isolation, then power transfer is achieved, but manufacturing cost increases
Solution Approach 1:
The patent integrates the transformer and capacitor functions into a single structure that can be manufactured as one unit using planar coil fabrication techniques. This eliminates the need for separate manufacturing processes for toroidal transformers and external capacitors, reducing overall manufacturing cost and complexity.
Solution Approach 2:
The patent replaces the traditional three-dimensional toroidal transformer structure with planar coils that can be fabricated using standard semiconductor manufacturing techniques. This substitution of mechanical construction methods with planar fabrication processes reduces manufacturing cost and improves ease of production.
3Reliability
If separate power supplies are used for each system, then galvanic isolation is maintained, but device complexity increases
Solution Approach 1:
The patent uses a single power supply that transfers power galvanically isolated to both the high-voltage and low-voltage systems through the integrated transformer structure. This eliminates the need for separate power supplies while maintaining galvanic isolation, reducing device complexity.
Solution Approach 2:
The integrated transformer structure serves as an intermediary that enables a single power supply to galvanically isolatedly power multiple systems. The high-voltage and low-voltage coils act as intermediaries that transfer power from the single power supply to both systems without direct electrical connection, maintaining isolation while reducing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of a galvanically-isolated power transformer within the semiconductor structure reduces manufacturing costs and size, providing efficient galvanic isolation for both signal and power paths while eliminating the need for external transformer attachment.
Implementation Method 1
non-conductive structure that prevents copper diffusion
Implementation Method 2
non-conductive structure that prevents copper diffusion and parasitic coupling
Implementation Method 3
integrates a transformer structure for power transfer
Data Source
AI summary
A galvanic die has signal structures and a transformer structure that provide galvanically-isolated signal and power paths for a high-voltage die and a low-voltage die, which are both physically supported by the galvanic die and electrically connected to the signal and transformer structures of the galvanic die.