Galvanic Isolation IC Parameterization via Shared Serial Channel
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Solution Overview
Problem
Existing isolation ICs face challenges in efficiently and cost-effectively parameterizing multiple isolation domains, particularly when accessing memories in dies or isolation domains is not feasible during product testing or operation.
Innovation Solution
An integrated circuit with galvanic isolation that includes a galvanic insulation barrier and channels configured to transmit logic signals and serial data streams across isolation domains, allowing for the storage of configuration information in a memory within one of the isolation domains.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If non-volatile memory is implemented in each isolation domain for parametrization, then customization capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent segments the memory resources by implementing non-volatile memory only in the first isolation domain (input side) while using volatile memory in the second isolation domain (output side). This segmentation allows customization capability while reducing overall device complexity by avoiding redundant non-volatile memory in each domain.
Solution Approach 2:
The patent introduces a serial communication channel as an intermediary mechanism to transfer configuration data from the first isolation domain to the second isolation domain. This mediator enables the output domain to access configuration information without requiring its own non-volatile memory, thus reducing complexity while maintaining adaptability.
2Productivity
If memory in each die is accessible during product testing, then parametrization efficiency is improved, but testing infrastructure complexity and cost increase
Solution Approach 1:
The patent performs the memory programming action in advance during manufacturing of the first die, before the complete multi-die assembly is formed. The configuration data is written to the non-volatile memory in the input domain during standard die fabrication testing, which is already in place, avoiding the need for specialized testing infrastructure for the isolated domains.
Solution Approach 2:
The patent extracts the memory programming operation from the final packaged product testing stage and moves it to the earlier die fabrication stage. This extraction allows parametrization to be performed using existing manufacturing test equipment rather than requiring complex post-packaging testing infrastructure.
3Reliability
If multiple transmission channels are provided for each signal, then signal transmission reliability is improved, but device complexity and cost increase
Solution Approach 1:
The patent makes the single transmission channel universal by enabling it to perform multiple functions: transmitting logic signals during normal operation and transmitting serial configuration data during programming. This multi-functionality eliminates the need for separate dedicated channels for each function, reducing device complexity while maintaining reliable signal transmission.
Solution Approach 2:
The patent introduces dynamic functionality to the transmission channel, allowing it to switch between different operational modes (logic signal transmission vs. configuration data transmission). This dynamic capability enables a single channel to serve multiple purposes, reducing the number of channels needed while maintaining system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient parameterization of isolation ICs by allowing serial data streams to be transmitted across isolation domains for storing configuration information, thereby improving customization and operation of the ICs without direct access to memories in all isolation domains.
Implementation Method 1
One important example of inductive signal transmission are integrated coupled inductors also referred to as coreless transformers
Implementation Method 2
One important example of inductive signal transmission are integrated coupled inductors also referred to as coreless transformers
Implementation Method 3
The isolation IC may have one or more dies for each isolation domain and data is exchanged between the isolation domains across the galvanic insulation barrier via inductive, capacitive or optical signal transmission
Data Source
AI summary
An integrated circuit with galvanic isolation is described herein. In accordance with one example, the circuit comprises a galvanic insulation barrier including a first isolation element configured to separate a first isolation domain from a second isolation domain and a first channel configured to transmit—in a first mode of operation and across the first isolation element—a logic signal from a first input in the first isolation domain to a first output in the second isolation domain. The first channel is further configured to transmit—in a second mode of operation and across the first isolation element—a serial data stream from the first input to a logic circuit in the second isolation domain, wherein the logic circuit is configured to receive—in the second mode of operation—the serial data stream and to store configuration information included in the serial data stream in a memory.