Galvanic Plating Current Distribution Grid for Uniform Deposition
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Solution Overview
Problem
Galvanic plating for depositing metallic layers on large areas, such as in extended wafer level packaging, often results in inhomogeneous layers with significant thickness variations and poor growth in the center, due to metallic layer growth starting from edge portions.
Innovation Solution
A current distribution grid is used to facilitate a distributed growth of metallic material during galvanic plating by providing a network of conductive rails and vias that allow for even deposition across the surface, ensuring a homogeneous metallic layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If galvanic plating is used to deposit metallic layers on large areas, then the metallic layer can cover the entire surface, but the layer becomes inhomogeneous with significant thickness variations
Solution Approach 1:
The patent divides the large-area substrate into multiple smaller plating zones by introducing a current distribution grid. This grid segments the continuous large area into discrete regions, each with its own local current distribution characteristics, enabling more uniform thickness control across the entire large area while maintaining comprehensive coverage
Solution Approach 2:
The patent applies local quality by using a current distribution grid that provides location-dependent current density control. Different regions of the large substrate receive optimized local current distribution through the grid structure, ensuring each local area achieves uniform plating while the entire large area is covered
2Area of stationary object
If galvanic plating is used on large areas, then complete coverage is achieved, but growth starts from edge portions resulting in poor center growth
Solution Approach 1:
The current distribution grid segments the plating process into multiple independent current pathways distributed across the substrate. This segmentation allows simultaneous or near-simultaneous nucleation and growth throughout the entire area, preventing the edge-first growth pattern that causes poor center deposition quality
Solution Approach 2:
The patent implements equipotentiality through the current distribution grid that creates multiple equipotential zones across the substrate. This ensures more uniform electric field distribution and current density throughout the entire large area, enabling reliable and high-quality deposition across all regions including the center, rather than just at the edges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a homogeneous and evenly distributed metallic layer with reduced thickness variations, improving the quality of the metallic layer deposition on large areas.
Implementation Method 1
depositing a metallic layer onto the substrate by galvanic plating
Data Source
AI summary
The method comprises providing a plurality of electronic devices, embedding the electronic devices in an encapsulation layer, forming vias into the encapsulation layer, the vias extending from a main face of the encapsulation layer to the electronic devices, and depositing a metallic layer onto the encapsulation layer including the vias by galvanic plating, the method further comprising providing a current distribution layer for effecting a distributed growth of the metallic material during the galvanic plating.