Galvanically-Isolated Data Transmission Device Using Multifrequency Acoustic Signals
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing galvanically-isolated data transmission devices are limited in their ability to transmit multi-frequency signals and require complex decoding systems, which reduce the maximum input frequency and increase design complexity.
Innovation Solution
A galvanically-isolated data transmission device is designed with a first array of ultrasonic transducers on one surface of a wafer converting signals into multifrequency acoustic signals, and a second array with at least two assemblies of transducers having different resonance frequencies, allowing for the transmission of binary data coded over various frequencies without the need for complex decoding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single-resonance-frequency transducer array is used for galvanic isolation, then the device structure is simple, but it cannot transmit multi-frequency signals and requires complex decoding systems
Solution Approach 1:
The transducer array is segmented into multiple sub-arrays, where each sub-array is designed to resonate at a specific frequency. This segmentation allows the system to handle multiple frequencies simultaneously while maintaining a structured and manageable configuration, resolving the contradiction between versatility and complexity.
Solution Approach 2:
The transducer array is designed with multi-functional capability by incorporating sub-arrays that can respond to different frequencies. Each sub-array serves a specific frequency function, while the overall system provides universal multi-frequency signal transmission capability, eliminating the need for complex external decoding systems.
2Adaptability or versatility
If complex decoding systems are added to handle multi-frequency signals, then signal transmission capability is improved, but the maximum input frequency is reduced and design complexity increases
Solution Approach 1:
Instead of adding complex decoding systems to handle multi-frequency signals after transmission, the invention inverts the approach by embedding frequency-specific resonance capabilities directly into the transducer array structure. This allows the system to naturally handle multi-frequency signals without requiring complex post-processing decoding, thereby maintaining high input frequencies.
3Adaptability or versatility
If complex decoding systems are implemented, then multifrequency signal handling is improved, but design complexity increases
Solution Approach 1:
The transducer array is designed to be self-sufficient in handling multi-frequency signals through its inherent multi-resonance structure. Each sub-array automatically responds to its designated frequency without requiring external complex decoding systems, making the system self-service capable and reducing overall design complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the simple and efficient transmission of multifrequency data without requiring complex decoding systems, effectively overcoming the limitations of existing devices by allowing higher input frequencies and reducing design complexity.
Implementation Method 1
A first array of ultrasonic transducers with a vibrating membrane is formed on a first surface of a wafer and is capable of converting the signal into a multifrequency acoustic signal propagating in the wafer
Implementation Method 2
A second array of ultrasonic transducers is formed on a second surface of the wafer
Implementation Method 3
A first array of ultrasonic transducers with a vibrating membrane
Data Source
AI summary
A data transmission device includes a coder configured to code the data into a multifrequency signal. A first array of ultrasonic transducers with a vibrating membrane is disposed on a first surface of a wafer. The first array configured to convert the signal into a multifrequency acoustic signal propagating in the wafer. A second array of ultrasonic transducers is disposed on a second surface of the wafer. The second array includes at least two assemblies of vibrating membrane ultrasonic transducers having resonance frequencies equal to two different frequencies of the multifrequency signal.


