Galvano Scanner Path Sequencing to Reduce Inertial Load
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Solution Overview
Problem
The lifetime of galvano scanners is reduced due to the inertial force load generated during reciprocation operations in laser processing, particularly when moving a laser beam between processing paths.
Innovation Solution
A laser processing apparatus is designed with a controller that optimizes the order of processing regions, setting the Y-coordinate of the return path to alleviate the load on the X-axis galvano scanner by sequencing processing regions to minimize inertial force, using a chuck table defined by X and Y axes, and including X and Y-axis galvano scanners to precisely position the laser beam.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the laser beam is moved at high speed by a galvano scanner to efficiently break the buffer layer, then the processing efficiency is improved, but the lifetime of the galvano scanner is reduced due to the load of inertial force generated at turnarounds
Solution Approach 1:
The controller pre-calculates and stores the optimal processing order of regions in an order-of-processing storing section before actual laser processing begins. By determining the sequence of processing regions in advance, the system can minimize the number of direction changes and inertial force loads on the galvano scanner, thereby extending its lifetime while maintaining high processing efficiency
Solution Approach 2:
The system dynamically adjusts the processing sequence based on the chuck table's movement state. When the chuck table is moving in a specific direction, the controller selects processing regions that align with that direction, reducing the need for the galvano scanner to make abrupt direction changes and thereby reducing inertial force loads
2Area of stationary object
If reciprocation operation is used to move the laser beam by the galvano scanner, then the laser beam can cover the entire processing area, but the inertial force load at turnarounds increases and reduces scanner lifetime
Solution Approach 1:
The processing order is predetermined and stored in the order-of-processing storing section, allowing the system to plan the laser beam's path across the entire processing area while minimizing reciprocation movements. This pre-planning ensures full area coverage is achieved with fewer direction changes, reducing inertial force loads and extending scanner lifetime
Solution Approach 2:
The system combines the chuck table's movement with the galvano scanner's positioning. By coordinating the chuck table's transport motion with the scanner's fine positioning, the system achieves complete area coverage while reducing the scanner's reciprocation burden, as the chuck table handles the bulk of the area coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration extends the lifetime of the X-axis galvano scanner by reducing the inertial force load during processing, ensuring efficient and prolonged operation.
Implementation Method 1
irradiation with a laser beam with a wavelength having transmissibility with respect to the epitaxy substrate and having absorbability with respect to the buffer layer is executed from the epitaxy substrate side to break the buffer layer
Data Source
AI summary
A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator that emits a laser beam, an X-axis galvano scanner that induces the laser beam emitted by the laser oscillator in an X-axis direction, a Y-axis galvano scanner that induces the laser beam in a Y-axis direction, and a controller that controls the X-axis galvano scanner and the Y-axis galvano scanner. The controller includes a processing region storing section that stores the X-coordinate and Y-coordinate of processing regions in which a workpiece held by a chuck table is processed and an order-of-processing storing section that stores setting of the order of processing of the processing region to be processed on a forward path through irradiation with the laser beam and the processing region of a return path to be subsequently processed.