Gamma Burst Detector Interconnection Circuit Design
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Solution Overview
Problem
Existing X and gamma radiation detectors face challenges in minimizing interference between sensors and processing units, particularly due to wired connections, which complicate manufacturing and reduce detector compactness and resolution.
Innovation Solution
A compact detector design featuring a multilayer interconnection circuit with a conductive grid extending between sensors, allowing for separate production and assembly of components, minimizing interference and optimizing radiation collection surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If sensors and processing unit are directly integrated, then interference is minimized, but manufacturing complexity increases and component separation is lost
Solution Approach 1:
The detector is divided into separate functional modules: sensors mounted on a support, a processing unit, and a multilayer interconnection circuit. This segmentation allows independent manufacturing of each component while maintaining low interference through spatial separation and dedicated connection paths.
Solution Approach 2:
A multilayer interconnection circuit acts as an intermediary between the sensors and the processing unit. This intermediary component provides structured electrical connections while maintaining physical separation between the sensors and processing unit, thus reducing interference without requiring direct integration.
2Ease of manufacture
If wired electrical connection is used to connect sensors and processing unit, then manufacturing is facilitated, but interference is introduced
Solution Approach 1:
The connection structure transitions from planar wiring to a three-dimensional multilayer interconnection circuit. This dimensional change allows multiple connection paths to be stacked vertically, reducing lateral interference between signals while maintaining manufacturing feasibility through standardized multilayer circuit board techniques.
3Volume of moving object
If connection device extends between sensors, then compactness is improved, but sensor surface area is reduced
Solution Approach 1:
The connection device is nested within the multilayer circuit structure, with connection paths routed through internal layers rather than occupying external space. This nesting allows the connection infrastructure to be embedded within the detector assembly, maintaining compactness without encroaching on the sensor collection surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables easier and cost-effective production of detectors with reduced interference, improved compactness, and enhanced resolution by separating sensors and processing units while maintaining efficient electrical connections.
Implementation Method 1
a high voltage electrical connection device comprising a part passing through the support and extending between two adjacent sensors to connect a pad for connecting the circuit to a conductive grid which extends at least in part between the sensors and which is electrically connected to a free face of each sensor
Implementation Method 2
Such detectors comprise sensors capable of interacting with gamma photons
Data Source
Figure 1
Figure 2~3
AI summary
The invention relates to a plane detector of a gamma burst imager, comprising a multilayer ceramic circuit for interconnection between external connectors and a processing circuit which are fixed on a rear face of the circuit and a detection module fixed on a front face of the circuit. The detection module comprises a support having a rear face fixed to the circuit and a front face on which are fixed sensors, and a high-voltage electrical connection device comprising a part passing through the support and running between two adjacent sensors so as to link a connection span of the circuit to a conducting grid which runs at least partly between the sensors and which is linked electrically to a free face of each sensor.