GaN Optical Device Carbon Doping Stability

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Solution Overview

Problem

III-nitride semiconductor optical devices face challenges with high resistance and complex conduction behaviors due to threading dislocations and the behavior of carbon as a dopant, which complicates crystallographic structures and affects conductivity.

Innovation Solution

A III-nitride semiconductor optical device with a p-type gallium nitride layer doped with carbon and magnesium, where the carbon concentration is between 2×10^16 cm^-3 and 1×10^19 cm^-3, and the angle of the primary surface is between 40 and 140 degrees, stabilizes carbon as a p-type dopant, reducing resistance and maintaining crystal quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If carbon is added to GaN film to increase electric resistance, then resistance increases, but conduction behavior becomes complicated and crystal quality deteriorates

Engineering Contradiction:
Improveelectric resistanceVSAvoidconduction behavior complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the doping parameter from conventional Mg-only doping to dual doping with Mg and C, where C concentration is controlled within 1×10^18 to 1×10^19 atoms/cm³. This parameter change stabilizes the p-type conduction behavior and prevents the complicated conduction phenomena observed in conventional high-resistance GaN films.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite doped structure by combining Mg and C dopants in the GaN film. This composite doping approach produces a synergistic effect where C atoms fill interstitial sites and passivate defects, while Mg provides holes, resulting in stable p-type conduction with high resistance without the complicated conduction behaviors seen in single-dopant systems.

Inventive Principle:
Principle #40Composite materials

2Reliability

If Mg doping is increased to achieve desired hole concentration, then hole concentration increases, but crystal quality deteriorates

Engineering Contradiction:
Improvehole concentrationVSAvoidcrystal quality
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces C atoms as an intermediary substance that mediates between Mg dopants and the GaN crystal lattice. The C atoms fill interstitial sites and passivate defects, allowing Mg to provide holes effectively without degrading crystal quality. This intermediary action enables achieving desired hole concentration while maintaining high crystal quality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the doping strategy from high Mg concentration to a combination of Mg and C doping with optimized concentrations. By controlling C concentration within 1×10^18 to 1×10^19 atoms/cm³, the system achieves the desired hole concentration with reduced Mg content, thereby preventing crystal quality deterioration.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If heterojunctions are included in GaN growth on Si substrate, then growth is enabled, but threading dislocations increase and conduction becomes complicated

Engineering Contradiction:
ImproveGaN growth on SiVSAvoidthreading dislocation density
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent converts the harmful effect of threading dislocations into a beneficial outcome by using C doping. The C atoms fill interstitial sites and passivate defects, including threading dislocations, transforming the high-dislocation-density situation into an advantage where the GaN film achieves stable p-type conduction and high resistance despite the heterojunction structure.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent changes the electrical and structural parameters of the GaN film by introducing C doping. This parameter change compensates for the negative effects of threading dislocations introduced by heteroepitaxial growth on Si substrates, achieving stable p-type conduction with hole concentration of 1×10^18 to 1×10^19 atoms/cm³ and resistance of 10^-3 to 10^-2 ohm·cm.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces resistance and improves crystal quality by stabilizing carbon as a p-type dopant, allowing for efficient hole concentration and electrical conductivity while minimizing the impact on n-type conductivity and emission characteristics.

Implementation Method 1

the p-type gallium nitride based semiconductor layer contains carbon as a p-type dopant

Methodology Applied
Scientific EffectDopant: Dopants

Implementation Method 2

carbon can be stably utilized as a p-type dopant in the GaN-based semiconductors

Methodology Applied
Scientific EffectInterstitial filling:

Implementation Method 3

Sample (A) exhibited p-type conduction and Sample (B) n-type conduction

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS8304793B2III-nitride semiconductor optical device and epitaxial substrate
Publication Date: 2012.11.06 SUMITOMO ELECTRIC INDUSTRIES LTD
  • US8304793B2 patent drawing
  • US8304793B2 patent drawing
  • US8304793B2 patent drawing

AI summary

A III-nitride semiconductor optical device has a support base comprised of a III-nitride semiconductor, an n-type gallium nitride based semiconductor layer, a p-type gallium nitride based semiconductor layer, and an active layer. The support base has a primary surface at an angle with respect to a reference plane perpendicular to a reference axis extending in a c-axis direction of the III-nitride semiconductor. The n-type gallium nitride based semiconductor layer is provided over the primary surface of the support base. The p-type gallium nitride based semiconductor layer is doped with magnesium and is provided over the primary surface of the support base. The active layer is provided between the n-type gallium nitride based semiconductor layer and the p-type gallium nitride based semiconductor layer over the primary surface of the support base. The angle is in the range of not less than 40° and not more than 140°. The primary surface demonstrates either one of semipolar nature and nonpolar nature. The p-type gallium nitride based semiconductor layer contains carbon as a p-type dopant. A carbon concentration of the p-type gallium nitride based semiconductor layer is not less than 2×1016 cm−3, and the carbon concentration of the p-type gallium nitride based semiconductor layer is not more than 1×1019 cm−3.