GaN Clamp Assembly Using Spring-Loaded Pistons for Even Pressure
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Solution Overview
Problem
Conventional clamps for GaN power transistors fail to provide uniform pressure and adjustability, leading to bending and non-uniform stress on the transistors and circuit boards, which affects heat dissipation and solder joint integrity.
Innovation Solution
A clamp assembly with a piston and pressure plate system, utilizing coil springs or Belleville washers, applies uniform force through a threaded fastener and top plate, allowing adjustable clamping force to ensure even pressure distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If conventional clamps are used to secure GaN power transistors to circuit boards, then the transistors are held in place, but non-uniform pressure is applied causing bending and stress on the transistors and circuit boards
Solution Approach 1:
The clamp assembly is divided into multiple independent clamping units, each with its own piston and pressure plate. Each clamping unit independently applies force to a specific region of the GaN power transistor, allowing localized pressure control and ensuring uniform pressure distribution across the entire transistor surface, thereby preventing bending and stress concentration.
Solution Approach 2:
Each clamping unit is designed to apply force locally at a specific position on the GaN power transistor. The pressure plates are positioned to contact specific regions of the transistor, ensuring that each local area receives appropriate pressure independently. This local quality approach prevents non-uniform stress distribution and bending that would occur with a single centralized clamping mechanism.
2Ease of manufacture
If conventional fixed clamps are used, then simple installation is achieved, but adjustability of clamping force is limited
Solution Approach 1:
The clamp assembly incorporates adjustable threaded fasteners that allow dynamic adjustment of the clamping force. By rotating the threaded fasteners, the piston can be positioned at different depths, thereby adjusting the compression force applied by the spring-loaded pressure plates. This dynamic adjustability enables the clamp to adapt to different GaN power transistor sizes and requirements while maintaining a relatively simple overall structure for ease of installation.
3Stability of the object's composition
If insufficient clamping force is applied, then no bending stress occurs, but heat dissipation efficiency decreases
Solution Approach 1:
The clamp assembly applies preliminary clamping force through spring-loaded pressure plates that automatically engage with the GaN power transistor upon assembly. This preliminary action ensures immediate contact and force application, securing the transistor firmly to the circuit board before operation begins. The pre-applied force ensures optimal thermal contact without requiring excessive tightening, thereby maintaining structural integrity while enabling efficient heat dissipation from the outset.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides uniform pressure across the GaN power transistors and circuit boards, reducing bending stress and enhancing heat transfer, thus improving thermal management and solder joint integrity.
Implementation Method 1
a bias member seated on the bias seat and applying a biasing force on the pressure plate to urge the surface mounted integrated circuit into contact with the circuit board. The bias member is one of a coil spring or a Belleville washer.
Implementation Method 2
a piston supported by the top plate via a threaded fastener engaging the top plate aperture, the piston arranged to be displaced relative to the top plate in accordance with adjustment of the threaded fastener
Implementation Method 3
a first frame support passing through a first aperture of a circuit board and fastened to a heat sink
Data Source
AI summary
A circuit board clamp includes a clamp frame having a first and second frame supports. The clamp frame also includes a top plate arranged between the first and second frame supports. The top plate supports a piston via a threaded fastener engaging a top plate aperture. The piston may be displaced relative to the top plate in accordance with adjustment of the threaded fastener. A pressure plate assembly has a pressure plate and a stem attached to the pressure plate. The stem is positioned within a tubular section of the piston, and the pressure plate is positioned opposite the circuit board from the heat sink. The pressure plate contacts a surface mounted integrated circuit between the circuit board and the pressure plate. A bias member is seated on the bias seat and applies a biasing force on the pressure plate.