GaN Power Converter Modular Plug-in Design
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Solution Overview
Problem
Existing electrical converters face challenges in achieving a compact, space-saving design while maintaining mechanical load capacity and reducing metallic material usage, particularly with high-power semiconductor switches that require significant heat sinks, which restrict component arrangement and connection options.
Innovation Solution
The use of power semiconductor switches with wide bandgap materials like GaN or InGaN, operated at high blocking voltages and frequencies, allows for the reduction or elimination of massive metallic heat sinks, enabling a plug-and-latch connection technology using non-metallic materials and snap connections for a compact, modular design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional metallic heat sinks and force-fit connecting elements are used, then mechanical load capacity and heat dissipation are ensured, but the converter becomes bulky and uses excessive metallic materials
Solution Approach 1:
The patent changes the material parameters by using wide-bandgap power semiconductor switches (GaN, InGaN) that can operate at higher temperatures and frequencies, enabling reduced heat sink mass while maintaining thermal management. This material parameter change allows downsizing of the converter structure.
Solution Approach 2:
The patent extracts and eliminates the massive metallic heat sink structure by using advanced semiconductor materials that generate less heat and can operate at higher temperatures. The heavy metallic thermal management component is removed while maintaining functional requirements through alternative, lighter materials and designs.
2Ease of manufacture
If bonded connection technologies are used, then material costs are reduced and manufacturing is simplified, but disassembly for maintenance becomes difficult
Solution Approach 1:
The patent segments the converter into modular plug-in components (electronic assemblies on subcarriers) that can be independently installed and removed. This segmentation enables simple plug-in connections without bonded technologies, maintaining manufacturing simplicity while allowing easy disassembly for maintenance of individual modules.
3Strength
If screw connections are used for mechanical assembly, then mechanical strength is ensured, but installation space requirements increase
Solution Approach 1:
The patent replaces the traditional screw connection mechanical system with a snap-in mechanical engagement system. The connecting elements feature geometric interlocking shapes that provide mechanical strength through form-fit connections, eliminating the need for screws and reducing installation space requirements.
4Reliability
If housing elements are assembled from different directions with tight tolerances, then protection ratings and EMC compliance are achieved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the housing into modular elements with standardized interfaces and integrated sealing features. This segmentation allows assembly from different directions while maintaining protection ratings through built-in sealing mechanisms, reducing the need for tight tolerances and complex alignment procedures.
Solution Approach 2:
The patent introduces intermediate sealing elements and transition pieces as mediators between housing components. These intermediaries ensure protection ratings and EMC compliance by providing standardized sealing interfaces, simplifying the assembly process and reducing tolerance requirements between main housing elements.
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
The invention relates to an electrical converter (1) for the operation of converter components that can be plugged together, comprising a first electronic assembly (2) having electronic parts (3), an assembly carrier (4), a housing chassis (5) and a housing cover (6), wherein at least one of the electronic parts (3) is a power semiconductor switch (19) having a wide band gap and made of GaN or of InGaN and the at least one power semiconductor switch (19) is operated with a reverse bias of at least 400 V and with a clock frequency of at least 40 kHz during operation of the electrical converter (1), the first electronic assembly (2) is mechanically connected to the assembly carrier (4) in a plugged manner by means of connecting elements (7), and the first electronic assembly (2) plugged together with the assembly carrier (4) is mechanically connected in a plugged and locked manner, by means of further connecting elements (8), to the housing chassis (5) by the use of locking elements (9) of the housing chassis (5) or to the housing cover by the use of locking elements of the housing cover.