GaN Semiconductor Laser Cavity Structure for Short Resonant Lengths

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Solution Overview

Problem

Semiconductor lasers with GaN-based compounds face challenges in achieving stable laser oscillation at short resonant lengths due to high threading dislocation densities and low optical gain, which affects their efficiency and output.

Innovation Solution

A semiconductor laser body with a base semiconductor part and a compound semiconductor part containing GaN-based semiconductors, where the base semiconductor part has regions with varying threading dislocation densities and the compound semiconductor part includes optical resonators with m-plane or c-plane resonant end surfaces, optimized for low dislocation and high optical reflectance, allowing for stable laser oscillation even at short resonant lengths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the resonant length is shortened to improve device compactness, then the device size is reduced, but stable laser oscillation becomes difficult to achieve due to high threading dislocation densities and low optical gain

Engineering Contradiction:
Improvedevice sizeVSAvoidstable laser oscillation
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent applies local quality by creating a base semiconductor part with spatially varying threading dislocation density. Specifically, the region beneath the compound semiconductor part has a lower threading dislocation density compared to other regions of the base semiconductor part. This localized improvement in crystal quality beneath the active region enables stable laser oscillation at short resonant lengths by reducing dislocation-related non-radiative recombination, while maintaining the compact device size.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If conventional base semiconductor parts with high threading dislocation densities are used, then the manufacturing process is simpler, but reflection loss increases and light emission efficiency decreases

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidreflection loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent applies parameter changes by modifying the threading dislocation density distribution in the base semiconductor part. Instead of using a uniform high-density structure, the invention creates a heterogeneous density profile where the region beneath the compound semiconductor part has reduced threading dislocation density. This parameter modification reduces non-radiative recombination centers, thereby decreasing reflection loss and improving light emission efficiency while maintaining manufacturing feasibility through controlled growth processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enables stable laser oscillation and high efficiency at short resonant lengths, reducing reflection loss and enhancing light emission efficiency by minimizing dislocation effects and optimizing resonant end surface planarity and reflectance.

Implementation Method 1

at least one of the pair of resonant end surfaces is an m-plane or a c-plane of the compound semiconductor part

Methodology Applied
Scientific EffectOptical reflection: Reflection

Data Source

PatentUS20240283219A1Semiconductor laser body, semiconductor laser element, semiconductor laser substrate, electronic apparatus, and manufacturing method and manufacturing apparatus of semiconductor laser device
Publication Date: 2024.08.22 KYOCERA CORP
  • US20240283219A1 patent drawing
  • US20240283219A1 patent drawing
  • US20240283219A1 patent drawing

AI summary

A semiconductor laser body includes a base semiconductor part and a compound semiconductor part positioned on the base semiconductor part and containing a GaN-based semiconductor. The base semiconductor part includes a first portion and a second portion having a lower density of threading dislocation extending in a thickness direction than the first portion, the compound semiconductor part includes an optical resonator including a pair of resonant end surfaces, at least one of the pair of resonant end surfaces is an m-plane or a c-plane of the compound semiconductor part, and a resonant length, which is a distance between the pair of resonant end surfaces, is equal to or less than 200 [μm].