GaN Microwave Generator Frequency Sweeping for Substrate Heating
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Solution Overview
Problem
Microwave heating of substrates in substrate treating processes often suffers from poor temperature uniformity due to large differences between hot spots and cold spots, which affects the efficiency and effectiveness of the treatment.
Innovation Solution
A substrate treating apparatus utilizing a gallium nitride (GaN) solid state device-based microwave power generator that sweeps frequencies across a specific bandwidth to generate multiple modes, improving heating uniformity by mixing hot and cold spots within the treating chamber, and functions as both a heating and plasma source for efficient substrate treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a microwave is used for substrate heating, then heating efficiency is improved, but temperature uniformity deteriorates due to large temperature differences between hot spots and cold spots
Solution Approach 1:
The patent implements dynamic frequency sweeping of the microwave source, continuously varying the operating frequency across a bandwidth (e.g., 2.3-2.7 GHz) to dynamically change the standing wave pattern and hot/cold spot locations within the chamber, thereby achieving uniform heating over time
Solution Approach 2:
The patent employs periodic frequency modulation where the microwave frequency is swept back and forth across a specified bandwidth multiple times during the heating process, creating periodic changes in the electromagnetic field distribution that progressively eliminate temperature non-uniformities
2Reliability
If separate plasma treatment and heating treatment chambers are used, then treatment quality is improved, but device complexity and processing time increase
Solution Approach 1:
The patent designs a single microwave generation system that can operate in multiple modes: generating plasma by ionizing gas at lower power levels and providing thermal heating at higher power levels, allowing one chamber to perform both plasma treatment and heating treatment functions
Solution Approach 2:
The patent combines the plasma generation function and thermal heating function into a single integrated microwave-based processing chamber, eliminating the need for separate plasma treatment chamber and heating chamber while maintaining the quality of both treatments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high temperature uniformity and allows for both plasma and heating treatments to be performed in a single chamber, reducing the need for separate equipment and increasing throughput by eliminating the need for device movement, while enhancing the uniformity of energy distribution.
Implementation Method 1
A microwave which is transmitted to a substrate after being generated by using the magnetron has a bad temperature uniformity
Implementation Method 2
microwave application unit functions as a plasma source for generating a plasma from the reaction gas
Data Source
AI summary
The inventive concept provides a substrate treating apparatus. In an embodiment the substrate treating apparatus includes a process chamber having a treating space therein for treating a substrate; a substrate support unit configured to support the substrate in the treating space; and a microwave application unit configured to apply a microwave to the treating space, and wherein the microwave application unit comprises a microwave power generator based on a solid state device.