GAN Process Parameter Prediction for Semiconductor Fabrication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor manufacturing industry faces challenges in reducing development time and costs due to the time-consuming and expensive trial-and-error approach in determining process parameters for semiconductor device fabrication, which slows down research and development and increases the time to market.
Innovation Solution
A system utilizing a neural network module configured with a generative adversarial network that generates process parameters for semiconductor devices based on device design files and material properties, incorporating an imaging system for additional training, thereby reducing the need for conventional trial-and-error methods and optimizing process parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a trial-and-error approach is used to determine process parameters, then process parameters can be determined through systematic testing, but development time and costs increase significantly
Solution Approach 1:
The patent creates a virtual copy of the semiconductor fabrication process through a trained neural network model. Instead of physically testing parameters on real wafers, the system copies the fabrication process in silico using the trained model, which has learned the complex relationships between process parameters and outcomes from historical data. This virtual copying eliminates the need for time-consuming physical trial-and-error while maintaining parameter determination accuracy
Solution Approach 2:
The patent performs preliminary training of the neural network model using historical fabrication data before actual parameter determination is needed. This preliminary action involves feeding the model extensive historical process data and outcomes, allowing it to learn optimal parameter relationships in advance. When actual parameter determination is required, the pre-trained model can quickly predict optimal parameters without needing to perform physical experiments
2Manufacturing precision
If a trial-and-error approach is used to determine process parameters, then process parameters can be determined through systematic testing, but research and development costs increase
Solution Approach 1:
The patent replaces physical material consumption with virtual simulation. The trained neural network model creates a digital twin of the fabrication process, allowing parameter optimization to be performed in the virtual domain. This copying approach eliminates the need to consume actual semiconductor materials, chemicals, and equipment time during the parameter determination phase, while still achieving accurate parameter identification
Solution Approach 2:
The system uses historical fabrication data that has already been collected during normal production to train the neural network model. This self-service approach means the system learns from its own past operations without requiring additional external resources or materials. The historical data serves dual purposes: it represents past material consumption that already occurred, and it provides the training fuel for the AI model that will eliminate future material waste
3Manufacturing precision
If conventional methods are used to determine process parameters, then parameters can be optimized through experimentation, but time to market increases
Solution Approach 1:
The patent replaces the mechanical system of physical experimentation with an information-based system. Instead of mechanically adjusting parameters and observing physical outcomes, the system uses information processing through the neural network model. The model processes historical data patterns and predicts optimal parameters computationally, substituting the slow mechanical trial-and-error process with rapid information analysis and prediction
Solution Approach 2:
The system fundamentally changes the approach from continuous physical parameter adjustment to discrete computational parameter prediction. The neural network model has learned the optimal parameter values or relationships from historical data, allowing it to directly predict suitable parameters for new fabrication scenarios without needing to physically explore the parameter space through experimentation
Data Source
AI summary
A device design file and material properties are inputted into a neural network module configured to operate a generative adversarial network. A process parameter is determined based on a device design file and material properties inputs using the generative adversarial network. This can be used to provide process parameters during semiconductor device design or manufacturing.


