Pick-and-Place Gantry Stabilizer for Die Bonding Alignment

Solution Overview

Problem

The challenge in advanced semiconductor packaging lies in accurately aligning and bonding dies without compromising system throughput, particularly due to shaky suction heads in pick-and-place systems, which result in position shift errors that limit bonding density.

Innovation Solution

A pick-and-place system with a gantry and stabilizer mechanism, combined with a vision alignment camera and optics alignment system, to stabilize the suction head and reduce position shift errors, ensuring precise alignment and bonding of dies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a pick-and-place system is used for die bonding, then automation and productivity are improved, but position shift errors occur due to shaky suction heads, reducing manufacturing precision

Engineering Contradiction:

Improvebonding throughputVSAvoidalignment accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The stabilizer is extended downwardly from the gantry before the suction head performs the pick-and-place operation, making preliminary contact with the substrate to establish a stable reference frame in advance, thereby preventing position shift errors during subsequent die bonding operations

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The stabilizer acts as an intermediary element between the gantry and the substrate, providing mechanical stabilization and reducing vibrations that would otherwise cause position shift errors during the die bonding process

Inventive Principle:

Principle #24Intermediary (Mediator)

2Quantity of substance

If bonding density is increased to improve integration density, then more components can be integrated, but position shift errors limit the achievable bonding density

Engineering Contradiction:

Improveintegration densityVSAvoidposition shift error

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The stabilizer is extended downwardly from the gantry before the suction head performs the pick-and-place operation, making preliminary contact with the substrate to establish a stable reference frame in advance, thereby preventing position shift errors during subsequent die bonding operations

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The vision alignment camera detects the position of alignment patterns on the substrate and provides feedback to the control system, which adjusts the gantry position to compensate for any deviations, thereby achieving precise alignment despite position shift errors

Inventive Principle:

Principle #23Feedback

3Manufacturing precision

If a vision alignment camera and optics alignment system are added to reduce position shift errors, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:

Improvealignment accuracyVSAvoidsystem complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The stabilizer acts as an intermediary element between the gantry and the substrate, providing mechanical stabilization and reducing vibrations that would otherwise cause position shift errors during the die bonding process

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The vision alignment camera detects the position of alignment patterns on the substrate and provides feedback to the control system, which adjusts the gantry position to compensate for any deviations, thereby achieving precise alignment despite position shift errors

Inventive Principle:

Principle #23Feedback

Data Source

PatentUS12469732B2Pick-and-place system with a stabilizer

Publication Date: 2025.11.11 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A pick-and-place system is provided. The pick-and-place system includes: a wafer holder; a gantry over the wafer holder and comprising a stabilizer extending downwardly; a primary drive mechanism connected to the gantry and configured to drive the gantry; a secondary drive mechanism located at the gantry; and a suction head, wherein the secondary drive mechanism is connected to the suction head and configured to drive the suction head.