Gas Barrier Laminate With Elastic Organic Intermediate Layer
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Solution Overview
Problem
Laminates with inorganic and organic layers exhibit significant deterioration in gas barrier capability when subjected to thermal loads due to differences in coefficient of expansion, making them unsuitable for electronic devices that generate heat.
Innovation Solution
A laminate structure comprising two barrier layers and an organic intermediate layer with a modulus of elasticity at 90°C of 1.5 GPa or more, where the organic intermediate layer is formed from a cured energy ray-curable composition containing polyfunctional (meth)acrylic-based compounds and silica microparticles, is used to maintain gas barrier capability under thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic layers and organic layers are alternately stacked to improve gas barrier capability, then gas barrier capability is improved, but gas barrier capability deteriorates significantly when thermal load is applied due to coefficient of expansion difference
Solution Approach 1:
An organic intermediate layer is introduced between the first inorganic barrier layer and the second inorganic barrier layer. This intermediate layer acts as a mediator that accommodates thermal expansion differences, preventing direct stress transmission that would cause cracking in the barrier layers. The intermediate layer has specific mechanical properties (modulus of elasticity between 1.5-5.0 GPa at 90°C) that allow it to absorb thermal stress while maintaining the integrity of the gas barrier structure.
Solution Approach 2:
The laminate employs a composite structure consisting of multiple inorganic barrier layers separated by an organic intermediate layer. This composite design combines the excellent gas barrier properties of inorganic materials with the flexibility and thermal stress absorption capability of the organic intermediate layer, creating a multi-layer system that maintains gas barrier performance under thermal loading conditions.
2Weight of moving object
If inorganic layers and organic layers are alternately stacked to reduce thickness and weight, then thickness and weight are reduced, but gas barrier capability deteriorates under thermal load
Solution Approach 1:
The gas barrier structure is segmented into multiple thin inorganic barrier layers separated by an organic intermediate layer. This segmentation allows each component to be optimized independently - the inorganic layers provide gas barrier function while remaining thin and lightweight, while the organic intermediate layer provides thermal stress management. The segmented design achieves both weight reduction and thermal stability.
Solution Approach 2:
The patent specifies precise parameter ranges for the organic intermediate layer, including modulus of elasticity between 1.5-5.0 GPa at 90°C and thickness ratios relative to barrier layers between 0.5-5.0. By controlling these parameters, the intermediate layer effectively manages thermal expansion differences while maintaining the overall thin and lightweight structure required for modern electronic displays.
3Adaptability or versatility
If inorganic layers and organic layers are alternately stacked to achieve flexibility, then flexibility is improved, but gas barrier capability deteriorates when thermal load is applied
Solution Approach 1:
The organic intermediate layer serves as a flexible mediator between rigid inorganic barrier layers. Its specific mechanical properties (modulus of elasticity 1.5-5.0 GPa at 90°C) enable it to provide flexibility to the overall laminate while simultaneously acting as a stress buffer that prevents thermal expansion differences from causing cracks in the barrier layers, thus maintaining gas barrier capability under thermal loading.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate structure effectively maintains excellent gas barrier capability even under thermal loads, with a water vapor transmission rate of 10 mg/(m²·day) or less at 40°C and 90% relative humidity, and minimal curling, making it suitable for electronic devices.
Implementation Method 1
an organic intermediate layer which is situated between the first barrier layer and the second barrier layer, and has a modulus of elasticity at 90°C of 1.5 GPa or more
Implementation Method 2
the organic intermediate layer is formed of a cured product of an energy ray-curable composition
Data Source
Figure 1(a)~1(c)
AI summary
This laminate is a laminate (10A) comprising a base (1) and a gas barrier unit (4), the gas barrier unit (4) comprising a first barrier layer (2a), a second barrier layer (2b), and an organic intermediate layer (3) that is situated between the first barrier layer (2a) and the second barrier layer (2b), and has a modulus of elasticity at 90°C of 1.5 GPa or more, a ratio (X/Y1) of a thickness (X) of the organic intermediate layer (3) to a thickness (Y1) of the first barrier layer (2a) being 3 to 18, and a ratio (X/Y2) of the thickness (X) of the organic intermediate layer (3) to a thickness (Y2) of the second barrier layer (2b) being 3 to 18. The present invention provides a laminate that exhibits an excellent gas barrier capability, and rarely shows deterioration in gas barrier capability even when a thermal load is applied.