Gas Barrier Micro-Structure Adhesion for Flexible Electronics
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Solution Overview
Problem
Flexible substrates used in electronic devices are prone to moisture and oxygen infiltration, leading to accelerated aging and reduced device lifetime, as traditional side wall barrier structures may enhance adhesion but increase water vapor and oxygen permeation when thick.
Innovation Solution
An environmental sensitive electronic device package is designed with a first and second substrate, gas barrier structures, micro-structures, and a filler layer, where the micro-structures have a specific height ratio to the gas barrier structures, and the filler layer covers the device and gas barriers, enhancing adhesion and reducing permeation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of the adhesive between the side wall barrier structure and the flexible substrate is increased to improve adhesion, then the bonding strength is improved, but the permeation of water vapor and oxygen increases
Solution Approach 1:
The adhesive layer is segmented into multiple thin layers rather than a single thick layer. This segmentation maintains the total bonding strength while reducing the continuous path for moisture and oxygen permeation through the adhesive, effectively resolving the contradiction between adhesion strength and permeation resistance.
Solution Approach 2:
Different regions of the adhesive structure are given different properties: the adhesive includes both a first adhesive layer with higher bonding strength and a second adhesive layer with lower permeation characteristics. This local differentiation allows each region to optimize for its specific function, resolving the contradiction between strength and permeation resistance.
2Object-affected harmful factors
If a side wall barrier structure is employed to block moisture and oxygen, then the barrier performance is improved, but the device complexity increases
Solution Approach 1:
The side wall barrier structure is merged with the adhesive layers, combining the barrier function with the bonding function into a single integrated structure. This eliminates the need for separate barrier components and reduces overall device complexity while maintaining effective moisture and oxygen blocking.
Solution Approach 2:
The adhesive structure serves multiple functions simultaneously: it bonds the substrate to the barrier structure, provides moisture and oxygen blocking, and acts as a protective layer. This multi-functionality reduces the number of separate components needed, thereby reducing device complexity while improving barrier performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks moisture and oxygen, preventing delamination and extending the device's service life by increasing the contact surface area and improving the reliability of the package, especially under bending conditions.
Implementation Method 1
at least one gas barrier structures located between the first substrate and the second substrate and surrounding the environmental sensitive electronic device, each of the gas barrier structures having a first height
Implementation Method 2
a plurality of micro-structures located between the first substrate and the second substrate, each of the micro-structures having a second height, a ratio of the second height to the first height ranging from 1/250 to 1/100
Implementation Method 3
lamination the second substrate onto the filler layer, such that the first substrate is bonded with the second substrate through the filler layer
Data Source
AI summary
An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, gas barrier structures, micro-structures, and a filler layer is provided. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate. The gas barrier structures may be located between the first substrate and the second substrate and surround the environmental sensitive electronic device. The gas barrier structures have a first height. The micro-structures may be located between the first substrate and the second substrate and have a second height. A ratio of the second height to the first height ranges from 1/250 to 1/100. The filler layer may be located between the first substrate and the second substrate and covers the gas barrier structures and the environmental sensitive electronic device. A manufacturing method of an environmental sensitive electronic device package is also provided.