Gas-Blowing-Holes Plate Nozzle Array for Uniform Heating

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Solution Overview

Problem

Existing gas-blowing nozzle devices for reflow furnaces experience temperature non-uniformity in printed circuit boards due to gaps in heated-air-blowing hole arrangements orthogonal to the conveying direction, and complex configurations require separate top and bottom plates, neglecting shared gas-intake ports.

Innovation Solution

A gas-blowing-holes plate with a gas-intake-port array structure, featuring a nozzle layout divided into sections with staggered and phased gas-blowing holes and oval intake ports, allowing for uniform gas distribution and shared top and bottom usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If gas-blowing holes are arranged in a conventional multi-hole nozzle pattern, then heating efficiency is improved, but temperature uniformity deteriorates due to gaps in the arrangement orthogonal to the conveying direction

Engineering Contradiction:
Improveheating efficiencyVSAvoidtemperature uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The nozzle plate is segmented into multiple regions with different gas-blowing hole arrangements. Each region has holes positioned at specific intervals orthogonal to the conveying direction, creating overlapping gas flow patterns that eliminate temperature gaps and achieve uniform heating across the entire processed material width

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the nozzle plate have locally optimized hole arrangements tailored to specific heating requirements. The hole intervals and positions are varied across different sections to ensure each area receives appropriate gas flow density, achieving both high heating efficiency and uniform temperature distribution

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If separate top and bottom plates are used for complex nozzle configurations, then heating uniformity is improved, but device complexity increases

Engineering Contradiction:
Improveheating uniformityVSAvoidplate configuration complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A single nozzle plate design performs multiple functions by incorporating gas-blowing holes that serve both top and bottom heating requirements. The plate is designed with hole patterns that project gas flows in multiple directions, eliminating the need for separate top and bottom plates while maintaining heating uniformity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention merges the functions of separate top and bottom heating plates into a single integrated nozzle plate. The combined design features hole arrangements that simultaneously address heating requirements from both sides of the processed material, reducing device complexity while achieving uniform temperature distribution

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures uniform heating or cooling of conveyed members by gradient intake of gas, reducing temperature fluctuations and allowing for common top and bottom plate designs, enhancing manufacturing efficiency.

Implementation Method 1

discharging gas from plural gas-blowing holes arranged in a gas-blowing-holes plate and blowing the gas to a board to be soldered

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

The opening widths of the oval ports are formed so as to be gradually narrower with increasing distance from the center portion

Methodology Applied
Scientific EffectPressure gradient: Pressure Gradient

Data Source

PatentEP2941104B1Gas-intake-hole array structure and soldering device
Publication Date: 2017.11.15 SENJU METAL IND CO LTD
  • EP2941104B1 patent drawingFigure 1
  • EP2941104B1 patent drawingFigure 2A~2B
  • EP2941104B1 patent drawingFigure 3A~3B

AI summary

In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern P2 is arranged to be line symmetry with a nozzle pattern P1 in one upper or lower divided section of a nozzle layout region of the nozzle cover 3 relative to a center portion that is orthogonal to a conveying direction, as shown in FIG. 1. In order for the arrangement patterns diagonally arranged in the nozzle layout region to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 in the other upper or lower divided section. Intake ports 3b, 3c and 3d each having a predetermined opening width are arranged between two blowing nozzles 2 or more and across a first row thereof and plural other rows having different phases, in order to circulate the gas blown from the blowing nozzles 2. Widths of the intake ports 3b, 3c and 3d are set so that they are gradually become narrower with increasing distance from the center portion.