Gas Chip Ejection with Spiral Motion for Low-Stress Peeling
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Solution Overview
Problem
Existing chip ejecting apparatuses require time-consuming adjustments and can cause damage to semiconductor chips due to incorrect application of needles or pins during the peeling process, particularly for miniaturized and thinned chips, leading to reduced productivity.
Innovation Solution
A chip ejecting apparatus that peels chips from a dicing tape in a non-contact manner using a gas ejector controlled by an orthogonal robot and a controller, which adjusts the ejecting pressure and moves in a spiral pattern to minimize stress on the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a needle or pin ejecting apparatus is used to peel chips from the dicing tape, then the chips can be separated from the wafer, but stress is applied to the chips causing damage such as cracks
Solution Approach 1:
The patent replaces the mechanical needle or pin ejecting system with a gas-based ejecting system. Gas is introduced through holes in the support table to push the chip upward and separate it from the dicing tape without direct mechanical contact, thereby eliminating stress-induced damage to the chip.
Solution Approach 2:
The invention uses pneumatic pressure by introducing gas through multiple holes in the support table. The gas pressure lifts the chip from the dicing tape in a contactless manner, providing a gentle separating force that does not damage the chip structure.
2Manufacturing precision
If the ejecting apparatus is adjusted for different chip sizes or thicknesses, then the peeling process can be optimized, but it takes a lot of time to replace and fine-tune the apparatus
Solution Approach 1:
The support table with multiple holes serves as a universal ejecting structure that can handle chips of various sizes and thicknesses without requiring physical replacement or adjustment of the ejecting mechanism. The gas pressure system automatically adapts to different chip dimensions, eliminating setup time.
Solution Approach 2:
The gas pressure system is dynamically controllable, allowing the ejecting force to be adjusted electronically for different chip types. This dynamic adjustment capability replaces static mechanical adjustments, enabling quick adaptation to different chip specifications without physical reconfiguration.
3Reliability
If incorrect application of needle or pin occurs during chip peeling, then chip damage such as cracks occurs, but proper application requires precise control and management
Solution Approach 1:
By replacing the mechanical needle/pin system with a gas-based system, the patent eliminates the risk of incorrect mechanical application. The gas pressure is distributed uniformly through multiple holes, ensuring consistent and safe chip separation without requiring precise positioning or manual adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves productivity by reducing the need for apparatus adjustments and minimizing chip damage, ensuring efficient peeling and pickup of chips of varying sizes.
Implementation Method 1
an ejector under the wafer stage, the ejector configured to eject gas toward a lower surface of the dicing tape while being in a non-contact state with the dicing tape
Data Source
AI summary
A chip ejecting apparatus may include: a wafer stage configured to receive a dicing tape and a plurality of chips attached to the dicing tape; an ejector under the wafer stage, the ejector configured to eject gas toward a lower surface of the dicing tape while being in a non-contact state with the dicing tape; an orthogonal robot under the wafer stage, wherein the ejector is on an upper surface of the orthogonal robot; and a controller configured to: control the orthogonal robot and the ejector to move up and down in a first direction; control the orthogonal robot to move in a second direction or a third direction; control the ejector to move in a spiral manner in the second direction and the third direction by controlling the orthogonal robot to move in the spiral manner; and control an ejecting pressure of the gas of the ejector.