Gas Cluster Pressure Control for Fast Stable Substrate Cleaning

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Solution Overview

Problem

Existing gas cluster processing technologies face challenges in quickly reaching the required gas supply pressure and maintaining precise control over the pressure, leading to prolonged stabilization times and potential overshooting, which degrades controllability and affects the efficiency of substrate cleaning processes.

Innovation Solution

A gas cluster processing device and method that utilize a pressure control part with a back pressure controller, including a branch pipe and relief valve, to control the gas supply pressure by exceeding the required flow rate initially and then adjusting to maintain the set pressure, ensuring rapid stabilization and preventing overshooting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If the gas supply flow rate is increased to reach the set pressure faster, then the time to reach set pressure is reduced, but the supply pressure overshoots the set value which degrades pressure controllability

Engineering Contradiction:
Improvetime to reach set pressureVSAvoidpressure controllability
Core Design Contradiction:
Loss of timeVSManufacturing precision

Solution Approach 1:

The patent implements a feedback control mechanism where the actual gas supply pressure is continuously monitored and compared with the target pressure. Based on this comparison, the gas supply flow rate is dynamically adjusted - increasing it when pressure is below target and decreasing it when pressure approaches or exceeds target - thereby achieving rapid pressure attainment while preventing overshoot and maintaining precise controllability.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system dynamically adjusts the gas supply flow rate based on real-time pressure conditions rather than maintaining a fixed flow rate. The flow rate control is made adaptive, changing its magnitude according to the pressure deviation from the set point, which enables both rapid response and precise control without overshoot.

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If a pressure adjustment valve is used for fine adjustment of supply pressure, then the pressure precision is improved, but the response time to reach set pressure increases

Engineering Contradiction:
Improvepressure precisionVSAvoidresponse time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The system performs preliminary coarse adjustment of the gas supply flow rate to quickly bring the pressure close to the target value, before engaging the pressure adjustment valve for fine precision adjustment. This two-stage approach combines the speed of flow rate control with the precision of pressure valve adjustment, reducing overall response time while maintaining pressure precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system dynamically coordinates between flow rate control and pressure adjustment valve operation, transitioning from aggressive flow rate increases for rapid pressure buildup to subtle valve adjustments for precise pressure stabilization, optimizing both response time and pressure precision throughout the pressure attainment process.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for rapid attainment of the desired gas supply pressure in a short time, maintaining constant pressure during the cleaning process and enhancing controllability, thereby improving the efficiency and effectiveness of substrate cleaning.

Implementation Method 1

a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion

Methodology Applied
Scientific EffectAdiabatic expansion: Adiabatic Cooling

Data Source

PatentUS12172198B2Gas cluster processing device and gas cluster processing method
Publication Date: 2024.12.24 TOKYO ELECTRON LTD
  • US12172198B2 patent drawing
  • US12172198B2 patent drawing
  • US12172198B2 patent drawing

AI summary

There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.