Gas Concentration Control for Pressure Vessel Curing Ovens
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Solution Overview
Problem
Conventional gas concentration control devices are not suitable for high temperature and high pressure environments within pressure vessel curing ovens, which are essential for semiconductor packaging processes, as they lack durability and effectiveness in maintaining precise gas concentration.
Innovation Solution
A gas concentration control device with a gas inlet and outlet system, equipped with valves and sensors, that continuously monitors and adjusts gas concentration and pressure within the oven's accommodation space to maintain predetermined levels by controlling the flow of gas, utilizing a control unit connected to valves and sensors to ensure precise control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional measurement and control devices are used in the curing oven, then the device structure is simple, but the pressure endurability is poor and they cannot be used in high temperature and high pressure environment
Solution Approach 1:
The device is divided into separate functional modules: a housing structure that forms a pressure-resistant chamber, a measurement module with sensors isolated from direct high-pressure exposure, and a control module. This segmentation allows the pressure-resistant components to be optimized independently while maintaining overall system functionality.
Solution Approach 2:
A housing structure acts as an intermediary barrier between the high-pressure environment inside the curing oven and the measurement/control devices. The housing with its sealed chamber protects sensitive electronic components from direct exposure to high temperature and pressure, enabling reliable operation in extreme conditions.
2Measurement precision
If conventional control devices are used, then the device complexity is low, but the measurement precision of gas concentration is insufficient in high temperature and high pressure environment
Solution Approach 1:
Traditional mechanical measurement devices are replaced with electronic sensors including temperature sensors, pressure sensors, and gas concentration sensors. These electronic measurement systems provide higher precision and can operate reliably in high temperature and high pressure environments where mechanical devices would fail.
Solution Approach 2:
The control module receives real-time data from multiple sensors (temperature, pressure, gas concentration) and automatically adjusts control parameters to maintain optimal curing conditions. This closed-loop feedback system ensures high measurement precision translates into precise control despite the harsh environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise control of gas concentration and pressure within the high temperature and high pressure environment of a pressure vessel curing oven, ensuring consistent and reliable processing conditions for semiconductor packaging.
Implementation Method 1
a gas concentration detection device, which is operative for timed detection of concentration of a gas inside the accommodation space
Implementation Method 2
the accommodation space comprises at least one pressure sensor that is arranged therein to detect pressure therein
Implementation Method 3
the first valve is opened to allow gas to flow from the gas source into the accommodation space
Implementation Method 4
the second valve is opened at the time when opening the first valve
Implementation Method 5
When the result of the judgment of the control unit is that the predetermined concentration is reached, the first valve is closed
Implementation Method 6
In a preferred embodiment of the present invention, the control unit closes the second valve at the time when closing the first valve
Implementation Method 7
An electrical heating device is used to supply thermal energy that is required inside the curing oven
Implementation Method 8
a fan arranged in a center of the electrical heating device is driven by the driving motor to rotate. The fan comprises an agitation device to cause the heated high temperature high pressure gas inside the curing oven to flow and thus spread uniformly
Implementation Method 9
the high pressure removes voids that are existing in the adhesive material out of the adhesive material by means of pressure difference
Implementation Method 10
shrinks the voids contained in the adhesive material by means of the pressure difference
Data Source
AI summary
A gas concentration control device for pressure vessel is provided for controlling gas concentration inside an accommodation space that is set in an interior of a chamber formed inside a pressure vessel curing oven. The pressure vessel curing oven includes a gas inlet tube with a first valve and a gas outlet tube with a second valve, which are in communication with the accommodation space. The gas concentration control device includes a gas concentration detection device, which is operative for timed detection of concentration of a gas inside the accommodation space, and a control unit for setting a predetermined concentration, performing a judgment if the gas concentration inside the accommodation space reaches the predetermined concentration according to a detection result of the gas concentration detection device, and thereby controls the first valve and the second valve according to result of the judgment.