Gas-Cooled LED Lamp Thermal Management
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Solution Overview
Problem
Traditional manufacturing processes for LED lamps are unsuitable due to heat-generated issues that degrade LED performance and affect solder connections, limiting their lifespan and light pattern consistency.
Innovation Solution
An LED lamp design featuring an optically transmissive enclosure with a thermally conductive submount and helium or hydrogen gas for thermal coupling, which dissipates heat without hindering light emission and maintains LED performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional manufacturing processes with heat generation are used, then the enclosure can be fused to the stem, but the heat degrades LED performance and shortens LED life
Solution Approach 1:
The invention extracts the heat generation step from the enclosure fusion process by using a cold-fusion technique with a ferrule and adhesive, eliminating thermal exposure to LEDs while maintaining structural integrity of the lamp assembly
Solution Approach 2:
The invention introduces a ferrule as an intermediary component between the stem and enclosure, allowing mechanical fusion without direct heat application, and uses adhesive as a thermal barrier to protect LEDs during assembly
2Temperature
If a heatsink is included to cool LEDs, then LED operating temperature is maintained, but the heatsink hinders light emission and limits LED placement
Solution Approach 1:
The invention removes the traditional heatsink component entirely and replaces it with a gas-filled thermal management system, eliminating light blocking while maintaining thermal control through the optically transmissive enclosure and internal gas convection
Solution Approach 2:
The invention uses gas (air or other thermally conductive gas) filled in the enclosure to provide thermal coupling and cooling of LEDs through convection and conduction, replacing solid heatsink structures with a pneumatic thermal management system that does not obstruct light
3Strength
If the stem is fused using heat, then the glass stem is securely attached to the enclosure, but the solder connections between LEDs and PCB are affected and LEDs may loosen
Solution Approach 1:
The invention extracts the heat application step from the fusion process and replaces it with a cold-fusion method using a ferrule and adhesive, eliminating thermal damage to solder joints while maintaining secure structural attachment
Solution Approach 2:
The invention uses a disposable ferrule component that is mechanically fused to provide permanent structural support without requiring thermal processes that would compromise other components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools the LEDs, preventing performance degradation and ensuring consistent light distribution while allowing for a more compact and efficient LED placement, thus extending LED lifespan and maintaining light pattern consistency.
Implementation Method 1
A gas is contained in the enclosure to provide thermal coupling to the LED array
Implementation Method 2
The submount is thermally coupled to the gas for dissipating heat from the plurality of LEDs
Data Source
AI summary
In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. A board supports lamp electronics for the lamp and is located in the enclosure. The LED array is mounted to the board and LEDs are mounted on a submount formed to have a three dimensional shape. The board is electrically coupled to the LED array and the submount may be thermally coupled to the gas for dissipating heat from the plurality of LEDs.