Gas Delivery Assembly with Fast Valves for Semiconductor Processing
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Solution Overview
Problem
Existing gas delivery systems for semiconductor processing chambers are costly and complex, requiring multiple orifices and valves to control process gas flows, which complicates the delivery of gases and increases maintenance costs.
Innovation Solution
A gas delivery assembly with a gas manifold and fast acting valves, where each gas passageway has similar conductance, allowing for quick switching and precise control of process gas flow through multiple nozzles, reducing the need for multiple mass flow controllers and simplifying the system architecture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a system of fast valves and orifices is used to control process gas flows, then gas delivery precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts the flow control function from the gas delivery system by removing traditional mass flow controllers and replacing them with a simplified manifold system equipped with fast valves and orifices. This extraction allows precise gas delivery control to be achieved through a less complex architecture by separating the timing control (fast valves) from the flow regulation (orifices with equal conductance).
Solution Approach 2:
The patent changes the control parameter from continuous flow regulation (using mass flow controllers) to temporal control (using fast valve timing). By controlling the duration and timing of gas valve opening rather than continuously regulating flow rate, the system achieves precise gas delivery with simpler components. The orifices provide passive flow resistance while the active control is achieved through valve timing parameters.
2Manufacturing precision
If multiple mass flow controllers are used to control different process gases, then gas flow control precision is improved, but cost and maintenance requirements increase
Solution Approach 1:
The patent makes the fast valves and orifices perform multiple functions: they control timing, regulate flow rates, and enable rapid gas switching. This multi-functionality eliminates the need for dedicated mass flow controllers for each gas line, reducing the number of components while maintaining precise control over multiple process gases simultaneously.
Solution Approach 2:
The patent uses multiple orifices with substantially equal conductance as simple, inexpensive copies of complex flow control mechanisms. Instead of using expensive mass flow controllers for each gas line, the system employs replicated orifice structures that provide consistent flow resistance, achieving uniform gas delivery at lower cost.
3Speed
If fast gas exchange systems with multiple orifices are used, then gas switching speed is improved, but real estate requirements and system cost increase
Solution Approach 1:
The patent merges the gas switching function and the flow distribution function into a single integrated manifold system. Instead of having separate fast valve assemblies and orifice plates requiring significant space, the manifold integrates both functions in one compact component, reducing the system footprint while maintaining fast gas exchange capability.
Data Source
AI summary
Disclosed herein is a gas delivery assembly for processing a substrate. In one example, a processing chamber comprises a plurality of walls, a bottom, and a lid to form an interior volume. Gas nozzles provide gas into the interior volume. A substrate support is disposed in the interior volume, having a top surface that supports a substrate. A gas delivery assembly comprises a gas manifold, and is disposed outside of the processing chamber. Gas passageways extend from the gas manifold to the gas nozzles, each gas passageway having similar conductance. A controller is fluidically coupled to each of the gas passageways, and is configured to control the timing at which a first process gas flows from the gas delivery assembly through the controller into the gas manifold, and the timing at which a second process gas is injected into the gas manifold through the gas nozzles.