Semiconductor Gas Distribution Element Cleaning Method
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Solution Overview
Problem
Existing methods for cleaning gas distribution elements in semiconductor deposition chambers often damage small geometry features, limiting their useful lifetime due to aggressive etching by cleaning solutions.
Innovation Solution
A method and apparatus that protect small orifices by maintaining a gas flow to prevent cleaning solution entry during initial cleaning of larger surfaces, followed by controlled vacuum-assisted entry of the solution to clean the orifices, using a cleaning solution with etchants and passivators to minimize corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cleaning solution is used to clean the gas distribution element, then the deposited material is removed from the surfaces and orifices, but the gas distribution element is damaged and its useful lifetime is limited
Solution Approach 1:
The cleaning process is divided into distinct stages: an initial stage where the gas distribution element is protected from the cleaning solution, followed by a second stage where specific portions are selectively cleaned. This segmentation allows different parts of the component to receive appropriate cleaning treatment, removing deposited material while minimizing damage to sensitive features.
Solution Approach 2:
Different portions of the gas distribution element receive different treatments during cleaning. The method applies cleaning solution selectively to specific surfaces and orifices based on their cleaning needs, rather than exposing the entire component uniformly. This local quality approach ensures effective cleaning of contaminated areas while protecting sensitive small geometry features from over-etching.
2Reliability
If the cleaning solution contacts all surfaces including small orifices, then complete cleaning is achieved, but small geometry features are damaged due to over-etching
Solution Approach 1:
The cleaning process segments the component into portions requiring cleaning and portions requiring protection. By dividing the cleaning sequence into stages and selectively applying the cleaning solution to specific surfaces and orifices, the method achieves complete cleaning of contaminated areas while preserving the precision of small geometry features.
Solution Approach 2:
The method applies cleaning treatment with local quality by targeting specific surfaces and orifices that require cleaning while excluding sensitive small geometry features during the initial cleaning stage. This selective application removes deposited material from areas needing it while maintaining the manufacturing precision of delicate orifices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for effective cleaning of both large and small features, extending the lifetime of gas distribution elements by preventing over-etching and maintaining the integrity of small geometry features.
Implementation Method 1
the gas distribution element may be placed in cleaning solution, such as an acid bath, which etches any deposited material from the orifices and other surfaces of the gas distribution element
Implementation Method 2
flowing a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution
Implementation Method 3
at least one inlet adapted to deliver a fluid to the component and apply a vacuum to the component during cleaning of the component with a cleaning solution
Data Source
AI summary
In a first aspect, a method for cleaning a semiconductor fabrication chamber component having an orifice is provided. The method includes (A) placing the component into a bath having a cleaning solution; (B) flowing a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component; and (C) withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice. Numerous other aspects are also provided.