Gas Distributor Plasma Isolation for Substrate Protection
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Solution Overview
Problem
Existing substrate processing apparatuses using plasma for thin film deposition often damage substrates due to direct plasma discharge, leading to deteriorated film quality.
Innovation Solution
A substrate processing apparatus with a gas distributor having separate plasma discharge spaces between power source and ground electrodes, which are positioned to avoid overlapping with the thin film formation region, preventing direct plasma exposure to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If plasma discharge is performed directly on the substrate for thin film deposition, then deposition efficiency is improved, but substrate quality deteriorates due to plasma damage
Solution Approach 1:
The gas distributor is divided into multiple gas distribution modules, each with separate plasma discharge spaces. This segmentation allows plasma to be generated in controlled zones that do not directly contact the substrate, maintaining deposition efficiency while preventing substrate damage.
Solution Approach 2:
The plasma discharge function is extracted from the substrate-facing region and relocated to separate plasma discharge spaces within the gas distribution modules. This extraction removes the harmful plasma discharge from direct contact with the substrate while preserving the beneficial deposition process.
2Productivity
If plasma discharge space overlaps with thin film formation region, then deposition speed is increased, but film quality deteriorates
Solution Approach 1:
The plasma discharge spaces are positioned in a different spatial dimension relative to the substrate, specifically in the radial direction away from the substrate center. This dimensional separation allows plasma to be generated close to the substrate for efficient deposition without the discharge space overlapping with the thin film formation region, thus maintaining film quality.
3Device complexity
If gas distribution is performed through a single centralized system, then device complexity is reduced, but deposition uniformity deteriorates
Solution Approach 1:
The gas distribution system is segmented into multiple independent gas distribution modules, each capable of generating and distributing plasma-enhanced gas separately. This segmentation improves deposition uniformity by allowing localized control over different regions of the substrate, while the modular design keeps the overall system complexity manageable through standardized repeating units.
Solution Approach 2:
Each gas distribution module provides locally optimized plasma discharge and gas distribution tailored to its specific region of the substrate. This local quality approach ensures uniform deposition across the entire substrate surface by addressing the specific needs of each zone rather than using a single centralized distribution system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents substrate damage and enhances thin film deposition uniformity, efficiency, and quality by isolating the plasma discharge from the film formation area.
Implementation Method 1
a plasma discharge space is formed between the power source electrode and the ground electrode
Data Source
AI summary
Disclosed is an apparatus and method of processing substrate, wherein the apparatus comprises a process chamber; a substrate supporter for supporting at least one of substrates, wherein the substrate supporter is provided in the process chamber, and is rotated at a predetermined direction; a chamber lid confronting with the substrate supporter, the chamber lid for covering the process chamber; and a gas distributor having a plurality of gas distribution modules for distributing gas to the substrate, wherein the plurality of gas distribution modules are connected to the chamber lid, wherein each of the gas distribution modules includes a power source electrode and a ground electrode confronting each other, a plasma discharge space is formed between the power source electrode and the ground electrode, and the plasma discharge space is not overlapped with a thin film formation region of the substrate supported by the substrate supporter.